Detection method and detection equipment for audio chip

Abstract

The invention provides a detection method and detection equipment for an audio chip, which are used for carrying out electrical function detection and failure reason analysis on an audio chip to be detected. The method comprise a clamping step I, an electrical measurement step, an evaluation step I, an imaging step I, an evaluation step II, a clamping step II, an imaging step II and an analysis step, wherein in the imaging step, imaging equipment and a perspective imaging clamp are used for imaging a pin appearance connection condition and a packaging internal structure condition of an audio chip to be detected to obtain an imaging result; therefore, a checking process for checking whether defective product misjudgment caused by a connection problem exists in an electrical function detection process of the audio chip or not is realized through an imaging analysis means, and an analysis basis is provided for further analyzing an integrated circuit structure causing failure or low functional parameters in a package; and the production efficiency and the manufacturing process improvement capability of the audio chip are improved.

Description

technical field [0001] The invention relates to the field of production testing of audio chips, in particular to a testing method and testing equipment for audio chips. Background technique [0002] In the quantitative production process of industrial products, in order to ensure the quality of ex-factory products, the semi-finished or finished products of the products will be measured and tested in each stage of production. For chip products, after the overall packaging of the product is completed, functional testing will be carried out through the quality inspection process to ensure that the functional technical indicators of the chip product meet the technical requirements. Usually, this quality inspection process includes an electrical inspection step, which electrically connects the chip product to electrical inspection equipment or inspection fixtures via manual or automated equipment, and then the equipment runs or starts the pre-designed function inspection program ...

AI Technical Summary

Problems solved by technology

[0003] As the link between chip products and external circuits, chip pins usually have low-strength and easy-to-bend mechanical properties. During the above-mentioned quality inspection process, they are often prone to sound due to manual clamping operations or clamping errors of non-high-precision automation equipment. The poor connection between the chip pins and the inspection tool makes the inspection equipment feed back wrong performance parameters, which eventually leads to misjudgment of the quality inspection results of the chip product

Moreover, in the production process, the cause of defective products should be analyzed to ensure that the systematic error of the production equipment is eliminated and the production process is improved. Inside the chip assembly, it is difficult to efficiently visualize and analyze its internal real structure and state

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