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A heat dissipation structure and its processing method

A technology of heat dissipation structure and processing method, applied in cooling/ventilation/heating transformation, modification by conduction heat transfer, etc., can solve the problems of low heat dissipation efficiency, complex processing method, large amount of metal, etc., and achieve low processing cost, The effect of reducing weight and saving materials

Active Publication Date: 2021-07-09
FOSHAN FEICHENG METAL PROD CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

There are many existing heat dissipation structures. For example, a vapor chamber is a commonly used heat dissipation structure. There is a cavity inside, and the space in the cavity is filled with a liquid or vapor working medium that can absorb or release heat in phase change. The efficiency is not high. In order to increase the heat dissipation efficiency, the method of adding multiple fins has been tried, but this processing method is very complicated, and the amount of metal required is large and the cost is high.

Method used

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  • A heat dissipation structure and its processing method
  • A heat dissipation structure and its processing method
  • A heat dissipation structure and its processing method

Examples

Experimental program
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Effect test

Embodiment 1

[0039] refer to figure 1 and image 3 As shown, in one embodiment of the present invention, a method for processing a heat dissipation structure includes the following steps:

[0040] Step 1: Fabricate a vapor chamber 1 with multiple independent cavities 11, fill each cavity 11 with a phase-change working medium and seal it independently;

[0041] Step 2: Along the length direction of the cavity 11 of the chamber 1, a plurality of cutouts 2 penetrating through the upper and lower surfaces of the chamber 1 are processed on the chamber 1 by cutting or stamping; the adjacent cutouts There is at least one cavity 11 between 2;

[0042] Step 3: Stretching the vapor chamber 1 to enlarge the area of ​​the cutout 2 to obtain a heat dissipation structure with a mesh structure.

[0043] This processing method can make the vapor chamber 1 into a mesh-like heat dissipation structure through simple cutting and stretching, which increases the heat dissipation surface area, reduces the wei...

Embodiment 2

[0053] refer to Figure 4 and Figure 5 As shown, it is substantially the same as Embodiment 1, except that the first cutout 21 does not extend to the middle of the second cutout 22 . Specifically, along the length direction of the cavity 11, the cutouts 2 are arranged in multiple rows; the cutouts 2 in adjacent rows are respectively the first cutout 21 and the second cutout 22, and the first cutout 21 and the second cutout 22 staggered arrangement.

[0054] Preferably, in a direction perpendicular to the length of the cavity 11 , the first cutout 21 and the second cutout 22 are at least partially overlapped.

[0055] Preferably, the first slit 21 extends to the end of the second slit 22 close to the end of the first slit 21, so that along the length direction of the cavity 11, there are more connected parts between the two slits 2, The rigidity of the entire heat dissipation structure is better.

[0056] Compared with Embodiment 1, the structure of this embodiment is more...

Embodiment 3

[0058] refer to Figure 6 and Figure 8 As shown, it is substantially the same as Embodiments 1 and 2, except that the first cutouts 21 and the second cutouts 22 are not arranged alternately. Specifically, along the length direction of the cavity 11, the cutouts 2 are arranged in multiple rows; the cutouts 2 in adjacent rows are arranged side by side, which is more conducive to cutting and less difficult to process.

[0059] This embodiment is easier to process than Embodiments 1 and 2, but the increased heat dissipation surface area is less.

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Abstract

The invention discloses a processing method for a heat dissipation structure, comprising the following steps: Step 1: making a uniform temperature plate with a plurality of independent cavities, filling each cavity with a phase-changeable working medium and sealing it independently; Step 2: In the length direction of the chamber of the chamber, a plurality of incisions are processed on the chamber; there is at least one cavity between adjacent incisions; step 3: pull the chamber Stretching, the area of ​​the cutout is enlarged, and the heat dissipation structure of the mesh structure is obtained. The processing method obtains a heat dissipation structure of a mesh structure through simple cutting and stretching, increases a heat dissipation surface area, reduces air flow resistance, improves heat dissipation efficiency, and belongs to the technical field of heat dissipation.

Description

technical field [0001] The invention belongs to the technical field of heat dissipation, and more specifically relates to a processing method of a heat dissipation structure. Background technique [0002] With the development of science and technology, life is full of various electronic devices. These electronic devices will generate a lot of heat during operation. If the heat is not dissipated, the electronic devices will stop running or be damaged, so the heat dissipation structure is essential. a part of. There are many existing heat dissipation structures. For example, a vapor chamber is a commonly used heat dissipation structure. There is a cavity inside, and the space in the cavity is filled with a liquid or vapor working medium that can absorb or release heat in phase change. The efficiency is not high. In order to increase the heat dissipation efficiency, a method of adding multiple fins has been tried, but such a processing method is very complicated, requires a la...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H05K7/20
CPCH05K7/2039
Inventor 梅圣伟
Owner FOSHAN FEICHENG METAL PROD CO LTD
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