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An automatic application device for transistor heat dissipation paste for high-end equipment manufacturing

A technology of transistor and heat dissipation paste, which is applied in the field of automatic application device of transistor heat dissipation paste for high-end equipment manufacturing, which can solve the problems of single application, low production efficiency, and manpower consumption, and achieve the effect of simple operation

Active Publication Date: 2022-03-25
HANGZHOU JIRUI IND & TRADE CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] Aiming at the deficiencies of the prior art, the present invention provides an automatic application device for transistor thermal paste for high-end equipment manufacturing, which has the advantages of reduced manpower consumption, improved application uniformity, high production efficiency, automatic application, multiple applications and simple operation. It solves the problems of manpower consumption, poor coating uniformity, low production efficiency, single coating and complicated operation in the existing transistor coating method

Method used

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  • An automatic application device for transistor heat dissipation paste for high-end equipment manufacturing
  • An automatic application device for transistor heat dissipation paste for high-end equipment manufacturing
  • An automatic application device for transistor heat dissipation paste for high-end equipment manufacturing

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Embodiment Construction

[0022] The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only some, not all, embodiments of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the protection scope of the present invention.

[0023] see Figure 1-4 , an automatic application device for transistor heat dissipation paste for high-end equipment manufacturing, comprising a round box 1, the inner side of the round box 1 is fixedly connected with a first connecting rod 2, and the lower side of the first connecting rod 2 is fixedly connected with a first fixing block 3, The rear side of the first fixed block 3 is rotatably connected with a first arc-shaped rod 4, and the first arc-shaped ...

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Abstract

The invention relates to the technical field of integrated circuit design, and discloses an automatic application device for transistor heat dissipation paste for high-end equipment manufacturing, including a round box, the inner side of the round box is fixedly connected with a first connecting rod, and the front side of the rotating block is rotatably connected There is a second connecting rod, the lower side of the first arc-shaped rod is rotatably connected to the first connecting rod, the lower side of the first connecting rod is rotatably connected to the first slider, and the outer side of the first slider is slidably connected to the first track, The upper and lower sides of the first track are provided with a second fixed block, the outer side of the Pozi pole is fixedly connected with a connecting frame, and the left side of the connecting frame is fixedly connected with a storage room. This high-end equipment manufacturing transistor heat dissipation paste automatic application device drives the first slider to slide up and down in the first track, so that the heat dissipation paste of the first slider can be repeatedly applied to the transistors on the lower side. This structure achieves a reduction in manpower Consumption, improved application uniformity, high production efficiency and the effect of automated application.

Description

technical field [0001] The invention relates to the technical field of integrated circuit design, in particular to an automatic coating device for transistor thermal paste used in high-end equipment manufacturing. Background technique [0002] In the field of high-end equipment manufacturing, heat dissipation paste needs to be applied to transistors during the manufacturing process, so as to improve the service life of the equipment itself. Nowadays, the application methods of heat dissipation paste corresponding to transistors have gradually tended to be diversified. [0003] At present, most of the transistor heat dissipation pastes on the market are mainly applied manually, which mainly involves manual application one by one, which consumes a lot of manpower, and the application uniformity is poor, and the production efficiency is low, or an automatic application device can be installed, but Only a single transistor can be clamped, and the clamping operation is complicate...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B05C1/02B05C13/02
CPCB05C1/02B05C13/02
Inventor 徐惠
Owner HANGZHOU JIRUI IND & TRADE CO LTD