Copper foil adhesive tape with high shielding efficiency and manufacturing method thereof
A technology of shielding efficiency and copper foil, which is applied in the field of high shielding efficiency copper foil tape and its manufacturing, can solve the problems of insufficient shielding efficiency of copper foil tape, and achieve the effect of convenient and fast source, simple process and normal use
Inactive Publication Date: 2021-03-30
惠州市兆联电子科技有限公司
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Problems solved by technology
[0003] Based on this, it is necessary to provide a high shielding efficiency copper foil tape and its manufacturing method to solve the technical problem of insufficient shielding effectiveness of the existing copper foil tape
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[0020] In order to facilitate the understanding of the present invention, the present invention will be described more fully below in conjunction with the accompanying drawings. Preferred embodiments of the invention are given in the detailed description. However, the present invention can be implemented in many different forms and is not limited to the embodiments described and drawings herein. Rather, these embodiments are provided so that the disclosure of the present invention will be thorough and complete. The present invention can be implemented in many other ways different from those described here, and those skilled in the art can make similar improvements without violating the connotation of the present invention, so the present invention is not limited by the specific embodiments and accompanying drawings disclosed below .
[0021] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinar...
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Abstract
The invention relates to a copper foil adhesive tape with high shielding efficiency. The copper foil adhesive tape with high shielding efficiency comprises a copper foil layer, a first conductive acrylic adhesive layer, a conductive fiber layer, a second conductive acrylic adhesive layer and a release film which are stacked in sequence. Compared with an existing copper foil adhesive tape, the copper foil adhesive tape with the high shielding efficiency has the advantages that the performance of copper foil is improved by 15%-20%, the shielding efficiency of the copper foil adhesive tape with the high shielding efficiency reaches 110 db or above, electromagnetic radiation of a 5G mobile phone is effectively reduced, electromagnetic interference between the 5G mobile phone and other electricappliances is reduced, and the normal use of the 5G mobile phone and other electric appliances is ensured; and moreover, the method for manufacturing the high-shielding-efficiency copper foil adhesive tape is simple in process and can conveniently and quickly acquire raw material sources; an enterprise can quickly produce the high-shielding-efficiency copper foil adhesive tape; the high-shielding-efficiency copper foil adhesive tape is small in size; the production cost of the enterprise is effectively reduced; and the production efficiency of the enterprise is improved.
Description
technical field [0001] The invention relates to the technical field of copper foil tapes, in particular to a copper foil tape with high shielding efficiency and a manufacturing method thereof. Background technique [0002] Copper foil tape is a kind of metal tape. It is mainly used in electromagnetic shielding. It is divided into two types: electrical signal shielding and magnetic signal shielding. Electrical signal shielding mainly relies on the excellent electrical conductivity of copper itself, while magnetic shielding requires copper foil tape. Surface conductive material "nickel" is used to achieve the effect of magnetic shielding, so it is widely used in mobile phones, notebook computers and other digital products. At present, when the existing copper foil tape is applied to 5G and the future new generation communication system, the shielding effectiveness of the existing copper foil tape can only reach 80db to 100db, while the shielding effectiveness of the 5G and the...
Claims
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IPC IPC(8): C09J7/29C09J9/02B32B37/12B32B37/10H05K9/00
CPCC09J7/29C09J9/02B32B37/1284B32B37/10H05K9/009C09J2433/00
Inventor 李志云
Owner 惠州市兆联电子科技有限公司