Ce-Mg-containing high-strength heat-resistant aluminum alloy and preparation method thereof
An aluminum alloy, heat-resistant technology, applied in the field of metal material engineering, can solve problems such as rise, and achieve the effect of simple melting process, good casting performance and reducing viscosity
- Summary
- Abstract
- Description
- Claims
- Application Information
AI Technical Summary
Problems solved by technology
Method used
Image
Examples
Embodiment 1
[0034]A high-strength heat-resistant aluminum alloy containing Ce-Mg, including the following components and their weight percentages: Ce: 10%; Mg: 6%; the balance is Al.
[0035] A preparation method of a high-strength heat-resistant aluminum alloy containing Ce-Mg comprises the following steps:
[0036] S1: Making Ce elemental substance and Al elemental substance into aluminum-cerium alloy, and purifying the produced aluminum-cerium alloy;
[0037] S2: According to the chemical composition and stoichiometric ratio of the alloy, calculate the amount of raw materials required, preheat industrial pure aluminum ingots, magnesium ingots, and aluminum-cerium alloy raw materials to 170°C, and keep warm for 40 minutes;
[0038] S3: Add the preheated industrial pure aluminum and 2 / 3 of the aluminum-cerium alloy into the preheated crucible, and heat it to 760°C to melt. After all of them are melted, add pure magnesium and the remaining 1 / 3 Aluminum-cerium alloy, heat preservation for...
Embodiment 2
[0044] The difference between Example 2 and Example 1 is that the mass percentages of Ce, Mg and Al added during preparation are different.
Embodiment 3
[0045] The difference between embodiment 3 and embodiment 1 is: the preparation method is not the same, the copper mold wall thickness of step 3 in embodiment 1 is 15mm, and the copper mold wall thickness of step 3 in embodiment 3 is 10mm.
PUM
| Property | Measurement | Unit |
|---|---|---|
| thermal resistance | aaaaa | aaaaa |
| yield strength | aaaaa | aaaaa |
| yield strength | aaaaa | aaaaa |
Abstract
Description
Claims
Application Information
Login to View More 

