Formulations for advanced polishing pads

Abstract

Methods and formulations for manufacturing polishing articles used in polishing processes are provided. In one implementation, a UV curable resin precursor composition is provided. The UV curable resin precursor comprises a precursor formulation. The precursor formulation comprises a first resin precursor component that comprises a semi-crystalline radiation curable oligomeric material, wherein the semi-crystalline radiation curable oligomeric material is selected from a semi-crystalline aliphatic polyester urethane acrylate, a semi-crystalline aliphatic polycarbonate urethane acrylate, a semi-crystalline aliphatic polyether urethane acrylate, or combinations thereof. The precursor formulation further comprises a second resin precursor component that comprises a monofunctional or multifunctional acrylate monomer. The resin precursor formulation further comprises a photoinitiator, wherein the precursor formulation has a viscosity that enables the precursor formulation to be dispensed to form a portion of a polishing article by an additive manufacturing process.

Description

technical field [0001] Embodiments described herein generally relate to polishing articles and methods for making polishing articles for use in polishing processes. In particular, embodiments described herein relate to polishing pads produced by processes that result in improved polishing pad properties and performance, including tunable performance. Background technique [0002] Chemical mechanical polishing (CMP) is a conventional process that has been used in many different industries to planarize the surface of a substrate. In the semiconductor industry, polishing and planarization uniformity has become increasingly significant as device feature sizes continue to decrease. During the CMP process, a substrate, such as a silicon wafer, is mounted on a carrier head with a device surface placed against a rotating polishing pad. The carrier head provides a controllable load on the substrate to push the component surface against the polishing pad. A polishing liquid, such a...

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Problems solved by technology

For example, the presence of phase-separated micro- and macro-domains in the host mat can lead to additive bonding of nonlinear material responses, such as hysteresis in the storage modulus E' over multiple heating and cooling cycles, which typically Occurs during CMP processing of substrate lots, which can lead to polishing non-uniformity and unpredictable performance across substrate lots

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