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Organopolysiloxane composition for forming pressure sensitive adhesive layer, and use of same

A technology of polyorganosiloxane and adhesive layer, which is applied in the direction of pressure-sensitive film/sheet, film/sheet-shaped adhesive, adhesive, etc., and can solve problems such as inability to fully solve technical problems

Active Publication Date: 2021-04-13
DOW TORAY CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, some of the compositions specifically disclosed in the Examples and the like disclose a combination of resin components having different weight average molecular weights, but cannot sufficiently solve the technical problems of the present invention.

Method used

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  • Organopolysiloxane composition for forming pressure sensitive adhesive layer, and use of same
  • Organopolysiloxane composition for forming pressure sensitive adhesive layer, and use of same
  • Organopolysiloxane composition for forming pressure sensitive adhesive layer, and use of same

Examples

Experimental program
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Effect test

preparation example Construction

[0115] The preparation method of the polyorganosiloxane composition of the present invention is not particularly limited, and is carried out by uniformly mixing the respective components. A solvent may be added as needed, and it may be prepared by mixing at a temperature of 0 to 200°C using a known stirrer or kneader.

[0116] The polyorganosiloxane composition of the present invention forms a coating film by coating on a base material, and heats it at a temperature of 80 to 200°C, preferably at a temperature of 90 to 190°C to form a cured product. As the coating method, gravure coat, offset coat, indirect gravure, roll coater, reverse roll coater, air knife coater, curtain coater, and comma knife can be exemplified coating.

[0117] [Range of pressure-sensitive adhesiveness and adhesion]

[0118] The polyorganosiloxane composition of the present invention is characterized in that a cured layer obtained by curing the composition by a hydrosilylation reaction is pressure-sens...

Embodiment 1

[0173] 32.9 parts by weight of vinyl functional polydimethylsiloxane of component a, 52.6 parts by weight of MQ silicone resin of component b1, 44.4 parts by weight of MQ silicone resin of component b2, 92.3 parts by weight of toluene, and two parts by weight of component c1 0.756 parts by weight of terminal trimethylsiloxane-terminated dimethylsiloxane / methylhydrogensiloxane copolymer, and 0.577 parts by weight of a 20% solution of curing retarder of component e were mixed well at room temperature, and added to the mixture 0.484 parts by weight of the platinum-based hydrosilylation reaction catalyst of component d1 was used as a curing reactive polyorganosiloxane composition. The molar ratio (SiH / Vi ratio) of the amount of SiH groups in component c1 to the amount of alkenyl groups in component a was 34.9, and the content relative to the solid content of platinum metal was 30 ppm.

[0174]The composition was cured by the method described above, and the adhesive force, viscoela...

Embodiment 2

[0176] 32.2 parts by weight of vinyl functional polydimethylsiloxane of component a, 41.6 parts by weight of MQ silicone resin of component b1, 54.7 parts by weight of MQ silicone resin of component b2, 93.7 parts by weight of toluene, and two parts by weight of component c1 0.745 parts by weight of terminal trimethylsiloxane-terminated dimethylsiloxane / methylhydrogensiloxane copolymer, and 0.577 parts by weight of a 20% solution of curing retarder of component e were thoroughly mixed at room temperature, and added to the mixture 0.484 parts by weight of the platinum-based hydrosilylation reaction catalyst of component d1 was used as a curing reactive polyorganosiloxane composition. The molar ratio (SiH / Vi ratio) of the amount of SiH groups in component c1 to the amount of alkenyl groups in component a was 35.1, and the content relative to the solid content of platinum metal was 30 ppm.

[0177] The composition was cured by the method described above, and the adhesive force, v...

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Abstract

[Problem] To provide: a curable organopolysiloxane composition which forms a pressure sensitive adhesive layer that is able to be designed to have a wide range of storage elastic modulus (G') at low temperatures, while having excellent curability and practically sufficient adhesive force; and a use of this organopolysiloxane composition. [Solution] An organopolysiloxane composition for forming a pressure sensitive adhesive layer, which contains (A) a chain organopolysiloxane having an alkenyl group, (B) a mixture of (b1) an organopolysiloxane resin that has a molecular weight (Mw) of 4,500 or more and (b2) an organopolysiloxane resin that has a molecular weight (Mw) of less than 4,500, said organopolysiloxane resins having a content of hydroxyl groups and the like of 9% by mole or less, (C) an organohydrogen polysiloxane and (D) a hydrosilylation catalyst, and which is configured such that: the mass ratio of the component (B) to the component (A) is within the range of from 0.9 to 3.0; and the shear storage elastic modulus G' at -20 DEG C of a pressure sensitive adhesive layer that is obtained by curing this composition is within the range of from 0.77 MPa to 50.00 MPa.

Description

technical field [0001] The present invention relates to a cure-reactive polyorganosiloxane composition forming a pressure-sensitive adhesive layer. Specifically, the present invention relates to an adhesive having practically sufficient curing properties and adhesiveness, and capable of maintaining a shear storage modulus G' of 0.77 or more in a wide temperature range including a low temperature. Design modulus of cure-reactive polyorganosiloxane compositions. In addition, the present invention relates to applications such as a pressure-sensitive adhesive composition using the composition, a laminate using the composition, an electronic member, or a display device (including a flexible display, a touch panel, and the like). Background technique [0002] Compared with acrylic and rubber-based pressure-sensitive adhesive compositions, polysiloxane-based pressure-sensitive adhesive compositions are superior in electrical insulation, heat resistance, cold resistance, and adhesi...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C09J183/04B32B27/00C09J7/38C09J183/05C09J183/07
CPCC09J183/04C09J7/38C09J2483/00C09J2203/318C08G77/12C08G77/20C08G77/16C08G77/18C08L83/04C08K5/56C08L83/00C09J7/40C09J7/22C09J2301/312C09J2203/326C09J2301/162C08G77/08C08G77/80
Inventor 伊藤真树中村昭宏须藤通孝
Owner DOW TORAY CO LTD