Anti-bubble bonding pad and bonding pad anti-bubble processing method
An anti-bubble and pad technology, which is applied to the printed circuit connected with non-printed electrical components, the formation of conductive patterns, and the assembly of printed circuits with electrical components, etc.
Active Publication Date: 2021-04-16
LANGCHAO ELECTRONIC INFORMATION IND CO LTD
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Problems solved by technology
[0005] Since the copper wire plated on the inner wall of the via hole plays the role of heat conduction, the air enclosed by the solder paste and ink will expand when heated, which will easily lead to foaming, which not only affects the appearance, but also poses a certain safety hazard
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[0025] The core of the present invention is to provide an anti-bubble pad, which prevents solder paste from entering the via hole and avoids the generation of bubble interlayers.
[0026] In order for those skilled in the art to better understand the technical solution of the present invention, the anti-bubble pad and pad anti-bubble processing method of the present invention will be described in detail below with reference to the accompanying drawings and specific implementation methods.
[0027] The invention provides an anti-bubble pad. The pad is an entire copper skin area arranged on a PCB. The entire pad includes a soldering area 1 and a via area. The soldering area 1 and the via area are staggered from each other. 1 and the via area are a complete area respectively; the surface of solder area 1 is used for coating solder paste. When coating, first use a steel mesh to cover the pad. The size of the stencil matches the size of the stencil, and the solder paste is applied ...
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The invention provides an anti-bubble bonding pad which comprises a soldering tin area and a via hole area, the surface of the soldering tin area is used for coating soldering paste, via holes are formed in the range of the via hole area, the inner wall of eache via hole is plated with a metal layer, an inner cavity of the metal layer is provided with printing ink for sealing, and one end of the via hole is sealed through printing ink. The via holes are formed in the side edge of the soldering tin area, and at least one part of the via holes is located outside soldering paste coated in the soldering tin area in the section direction. According to the anti-bubble bonding pad, the soldering tin area is isolated from the via holes, the soldering paste cannot completely cover the end part of the via holes, so that the end part of the via hole cannot be sealed in the heating process, bubbles cannot be sealed between the ink layer and the soldering paste, bubbles are prevented from being heated to expand, and damage is prevented. The invention further provides a bonding pad anti-bubble processing method. The method can achieve the technical effect achieved by the anti-bubble bonding pad.
Description
technical field [0001] The invention relates to the technical field of printed circuit boards, and further relates to an anti-bubble pad. In addition, the invention also relates to a method for anti-bubble processing of pads. Background technique [0002] PCB (Printed Circuit Board), the Chinese name is printed circuit board, which is the support body of electronic components and the carrier of electrical connection. The lead holes on the PCB and the surrounding copper foil are called pads. The components pass through the lead holes on the PCB and are fixed on the PCB by soldering. The printed wires connect the pads to realize the electrical connection of the components in the circuit. [0003] A large number of via holes are used in PCB layout and wiring design, especially in various chips and power module (Power) areas. In order to ensure reliability, these via holes are semi-plugged with ink, and the vias are blocked with ink. The depth of the ink is smaller than the de...
Claims
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IPC IPC(8): H05K3/34H05K3/12H05K1/18
Inventor 邵小波荣世立
Owner LANGCHAO ELECTRONIC INFORMATION IND CO LTD