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Modified allyl compound, modified bismaleimide prepolymer and application thereof

A technology of allyl compound and bismaleimide, which is applied in non-polymer organic compound adhesives, unsaturated alcohol copolymer adhesives, organic chemistry, etc. Increased electrical constant and dielectric loss, poor heat resistance of cured products, etc., to achieve the effects of reducing water absorption, improving heat resistance, and improving solubility

Active Publication Date: 2021-04-20
GUANGDONG HINNO TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, modifiers such as 2,2'-diallyl bisphenol A (DABPA) are often used in the traditional technology to prepare modified bismaleimide prepolymers, although the properties of bismaleimide prepolymers can be improved. Solubility and compatibility, but it will increase the dielectric constant and dielectric loss of the cured product, and the cured product has poor heat resistance and high water absorption, which is difficult to apply in high-end integrated circuits

Method used

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  • Modified allyl compound, modified bismaleimide prepolymer and application thereof
  • Modified allyl compound, modified bismaleimide prepolymer and application thereof
  • Modified allyl compound, modified bismaleimide prepolymer and application thereof

Examples

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preparation example Construction

[0054] Further, the above-mentioned preparation method of the modified allyl compound includes the following steps S10-S30.

[0055] Step S10, performing a grafting reaction of compound 1 and compound 2 under the action of a first catalyst to obtain a first intermediate.

[0056] In some embodiments, the first catalyst is selected from one or more of boron trifluoride ether, boron trichloride ether, boron trifluoride dimethyl ether and boron trifluoride ethylenediamine.

[0057] In some of these embodiments, in step S10, the molar ratio of compound 1 and compound 2 is (1˜2)1.

[0058] In some of these embodiments, compound 1 is selected from phenol, or any one of phenols substituted by linear alkyl groups with 1 to 7 carbon atoms.

[0059] In some of these embodiments, compound 2 is selected from dicyclopentadiene or tricyclopentadiene.

[0060] In some of these embodiments, the above step S10 includes steps S11-S12.

[0061] Step S11, mixing compound 1 and the first cataly...

Synthetic example 1

[0150] 1), under a nitrogen atmosphere, add 2mol phenol into a four-necked flask equipped with a dropping funnel, a condenser, a stirrer and a thermometer, raise the temperature to 100°C, add 10g of catalyst (boron trifluoride ether), and then drop Add 1mol DCDP, control the rate of addition, and finish adding DCDP within 5 hours. Then keep warm for 2 hours and cool to room temperature, remove phenol and unreacted DCPD by distillation under reduced pressure, add solvent butanone after washing with water, remove solvent and part of water by filtration and distillation, then pour out the residue and cool to obtain DCPD phenol Resin, the product is ready for use, and the structure is as follows;

[0151]

[0152] 2) Under a nitrogen atmosphere, put 1 mol of 4-allyloxybenzoic acid and 1 mol of thionyl chloride into a three-necked flask filled with toluene, and reflux at 60° C. for 5 h until the solution becomes clear. After the reaction was completed, excess toluene and thiony...

Synthetic example 2

[0157] 1), under a nitrogen atmosphere, add 2mol phenol into a four-necked flask equipped with a dropping funnel, a condenser, a stirrer and a thermometer, raise the temperature to 100°C, add 15g of catalyst (boron trifluoride ether), and then drop Add 1 mol compound TCPD, control the dropping rate, and finish adding compound TCPD dropwise within 5 hours. Then keep warm for 2 hours and cool to room temperature, remove phenol and unreacted compound TCPD by vacuum distillation, add solvent butanone after washing with water, remove solvent and part of water by filtration and distillation, then pour out the residue and cool to obtain No. An intermediate, the product is ready for use, and the structure is as follows;

[0158]

[0159] 2) Under a nitrogen atmosphere, put 1 mol of 4-allyloxybenzoic acid and 1 mol of thionyl chloride into a three-necked flask filled with toluene, and reflux at 60° C. for 5 h until the solution becomes clear. After the reaction was completed, exces...

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Abstract

The present invention provides a modified allyl compound, a modified bismaleimide prepolymer and application thereof, the modified allyl compound is represented by a formula (1), the modified allyl compound has a cyclopentadiene structure represented by a formula (2), and contains a benzene ring or a benzene ring substituted by a linear alkane having a low polarity, when the modified allyl compound is used for modifying bismaleimide, the prepared modified bismaleimide prepolymer has a specific structure, the dissolvability of the bismaleimide can be improved, and the crosslinking density of the bismaleimide can be reduced, so that the water absorption rate, dielectric constant and dielectric loss value of resin can be reduced, and meanwhile, the heat resistance of the resin is improved.

Description

technical field [0001] The invention relates to the technical field of resin preparation, in particular to a modified allyl compound, a modified bismaleimide prepolymer and applications thereof. Background technique [0002] With the rapid development of the electronics industry, electronic products are developing in the direction of miniaturization, high functionality and high security, requiring electronic components to have higher signal propagation speed and transmission efficiency. high demands. In addition to requiring high heat resistance, peeling resistance and excellent mechanical properties of the electric board base material, it is also required to have lower water absorption, dielectric constant and dielectric loss value. [0003] In traditional technology, diamine-modified or allyl-modified bismaleimide resin is often used to prepare electric board substrates, but there are defects such as high curing temperature, high water absorption, high dielectric constant...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C07C69/757C08F283/04C08F216/12C08L51/08C08L79/04C08L61/34C08K13/04C08K7/14C08K3/36C08K5/3445
CPCC08G73/126C08F283/04C09J4/06C08F216/125C09J129/06C09J179/08C09J4/00C07C69/94C07C2603/68C07C2603/91C08L79/08C08F222/40C08G73/12C08G73/128C08G73/127
Inventor 郭永军温文彦张新权梁荣强
Owner GUANGDONG HINNO TECH CO LTD