Chip film expanding method
A chip and chip technology, applied in the direction of electrical components, circuits, semiconductor devices, etc., can solve problems such as waste, irregular arrangement, and affecting the production efficiency of light-emitting diode chips
Active Publication Date: 2021-04-20
HC SEMITEK SUZHOU
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Problems solved by technology
[0004] In the process of film expansion, if the spacing between multiple LED chips is uneven or the arrangement is not neat due to unstable equipment or process fluctuations, it will affect the fixing efficiency, and it is necessary to re-install multiple LED chips. arrangement
For the light-emitting diode chips whose size is too small to be rearranged, the multiple light-emitting diode chips on the first carrier film will be directly scrapped, which will affect the production efficiency of the light-emitting diode chip and cause waste
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[0040] In order to make the purpose, technical solution and advantages of the present disclosure clearer, the implementation manners of the present disclosure will be further described in detail below in conjunction with the accompanying drawings.
[0041] Unless otherwise defined, the technical terms or scientific terms used herein shall have the usual meanings understood by those having ordinary skill in the art to which the present disclosure belongs. "First", "second", "third" and similar words used in the specification and claims of this disclosure do not indicate any order, quantity or importance, but are only used to distinguish different components . Likewise, words like "a" or "one" do not denote a limitation in quantity, but indicate that there is at least one. Words such as "comprises" or "comprising" and similar terms mean that the elements or items listed before "comprising" or "comprising" include the elements or items listed after "comprising" or "comprising" a...
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The invention provides a chip film expanding method, and belongs to the technical field of light emitting diodes. The method comprises the following steps: if a plurality of light-emitting diode core particles on a first bearing film are not uniformly distributed and adjusting operation needs to be carried out, heating the first bearing film to be used as a first bearing film shrinkage film of a thermal shrinkage film until the distance between every two adjacent light-emitting diode core particles on the first bearing film is zero; pouring the plurality of light-emitting diode core particles on the first bearing film to the second bearing film, and expanding the second bearing film to make the distances between every two adjacent light-emitting diode core particles equal; and if the plurality of light-emitting diode core particles on the second bearing film are not uniformly distributed, repeating the above steps until the plurality of light-emitting diode core particles on the second bearing film are uniformly distributed. Compared with the condition that the light-emitting diode core particles need to be rearranged or directly scrapped due to irregular arrangement in the traditional mode, the method can greatly improve the preparation efficiency of the light-emitting diode, and reduces the preparation cost of the light-emitting diode.
Description
technical field [0001] The present disclosure relates to the technical field of light-emitting diodes, in particular to a chip expansion method. Background technique [0002] A light emitting diode is a semiconductor electronic component that emits light. As an efficient, environmentally friendly and green new solid-state lighting source, it is being rapidly and widely used, such as traffic lights, car interior and exterior lights, urban landscape lighting, mobile phone backlight, etc. Improving the luminous efficiency of chips is the goal that LEDs are constantly pursuing. The light-emitting diode epitaxial wafer is the basic structure of the light-emitting diode chip. The preparation of the light-emitting diode chip from the light-emitting diode epitaxial wafer requires at least the processes of cutting, splitting, expanding, sorting, bonding and packaging. [0003] After the light-emitting diode epitaxial wafer is cut and split and expanded, a plurality of light-emitting...
Claims
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Login to View More IPC IPC(8): H01L33/00H01L21/683H01L21/78
Inventor 李浩然肖千宇蔡永成闫俊辰薛康张少峰王斌
Owner HC SEMITEK SUZHOU