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Organopolysiloxane composition for forming pressure sensitive adhesive layer, and use of same

A polyorganosiloxane, adhesive layer technology, applied in other household appliances, pressure sensitive films/sheets, applications, etc., capable of solving problems such as technical problems that cannot be adequately solved

Active Publication Date: 2021-04-23
DOW TORAY CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, some of the compositions specifically disclosed in the Examples and the like disclose a combination of resin components having different weight average molecular weights, but cannot sufficiently solve the technical problems of the present invention.

Method used

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  • Organopolysiloxane composition for forming pressure sensitive adhesive layer, and use of same
  • Organopolysiloxane composition for forming pressure sensitive adhesive layer, and use of same
  • Organopolysiloxane composition for forming pressure sensitive adhesive layer, and use of same

Examples

Experimental program
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Effect test

preparation example Construction

[0126] The preparation method of the polyorganosiloxane composition of the present invention is not particularly limited, and is carried out by uniformly mixing the respective components. A solvent may be added as needed, and it may be prepared by mixing at a temperature of 0 to 200°C using a known stirrer or kneader.

[0127] The polyorganosiloxane composition of the present invention forms a coating film by coating on a base material, and heats it at a temperature of 80 to 200°C, preferably at a temperature of 90 to 190°C to form a cured product. As the coating method, gravure coat, offset coat, indirect gravure, roll coater, reverse roll coater, air knife coater, curtain coater, and comma knife can be exemplified coating.

[0128] [Range of pressure-sensitive adhesiveness and adhesion]

[0129] The polyorganosiloxane composition of the present invention is characterized in that a cured layer obtained by curing the composition by a hydrosilylation reaction is pressure-sens...

Embodiment 1

[0184] 50.0 parts by weight of vinyl functional polydimethylsiloxane of component a, 69.0 parts by weight of MQ silicone resin of component b2, 119.1 parts by weight of toluene, and two ends of trimethylsiloxane groups of component c1 were terminated with two 1.00 parts by weight of methylsiloxane / methylhydrogensiloxane copolymer, 0.600 parts by weight of a 20% solution of a curing retarder of component e were thoroughly mixed at room temperature, and 0.577 parts of a platinum-based hydrosilylation reaction catalyst of component d2 was added to the mixture. parts by weight and as a curing reactive polyorganosiloxane composition. The molar ratio (SiH / Vi ratio) of SiH groups in component c1 to the amount of alkenyl groups in component a was 30.5, and the content relative to the solid content of platinum metal was 30 ppm.

[0185] This composition was cured by the above-mentioned method, and the adhesive force, viscoelasticity, and stress-strain with respect to the PMMA plate wer...

Embodiment 2

[0187] 46.5 parts by weight of vinyl functional polydimethylsiloxane of component a, 73.8 parts by weight of MQ silicone resin of component b2, 117.8 parts by weight of toluene, and two ends of trimethylsiloxane groups of component c1 were capped with two 0.958 parts by weight of a methylsiloxane / methylhydrogensiloxane copolymer, 0.577 parts by weight of a 20% solution of a curing retarder of component e, were thoroughly mixed at room temperature, and 0.577 parts by weight of a platinum-based hydrosilylation reaction catalyst of component d2 was added to the mixture. parts by weight and as a curing reactive polyorganosiloxane composition. The molar ratio (SiH / Vi ratio) of SiH groups in component c1 to the amount of alkenyl groups in component a was 31.3, and the content relative to the solid content of platinum metal was 30 ppm.

[0188] This composition was cured by the above-mentioned method, and the adhesive force, viscoelasticity, and stress-strain with respect to the PMMA...

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Abstract

Provided are: a curable organopolysiloxane composition which forms a pressure sensitive adhesive layer that has low storage elastic modulus (G'), excellent curability and sufficient adhesive force; and a use of this organopolysiloxane composition. An organopolysiloxane composition for forming a pressure sensitive adhesive layer contains (A) a chain organopolysiloxane having an alkenyl group, (B) an organopolysiloxane resin that has a weight average molecular weight (Mw) of less than 4,500, while having a total content of hydroxyl groups and the like of 9% by mole or less, (C) an organohydrogen polysiloxane, (D) a hydrosilylation catalyst, and if necessary, (A') a chain organopolysiloxane that does not contain a carbon-carbon double bond-containing reactive group in each molecule. The mass ratio of the organopolysiloxane resin to the chain organopolysiloxane is within a specific range; and the shear storage elastic modulus G' at -20 DEG C of a pressure sensitive adhesive layer that is obtained by curing this composition is within the range of from 0.01 MPa to 1.0 MPa.

Description

technical field [0001] The present invention relates to a cure-reactive polyorganosiloxane composition forming a pressure-sensitive adhesive layer. Specifically, the present invention relates to a polysilicone having practically sufficient curing properties and adhesive force, and low curing reactivity in a shear storage modulus G' in a wide temperature range including low temperatures. Oxygen composition. In addition, the present invention relates to applications such as a pressure-sensitive adhesive composition using the composition, a laminate using the composition, an electronic member, or a display device (including a flexible display, a touch panel, and the like). Background technique [0002] Compared with acrylic and rubber-based pressure-sensitive adhesive compositions, polysiloxane-based pressure-sensitive adhesive compositions are superior in electrical insulation, heat resistance, cold resistance, and adhesion to various adherends. Excellent, so it is used for ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C09J183/04B32B27/00C09J7/38C09J183/05C09J183/07
CPCC09J183/04C09J7/38C09J2483/00C09J2203/326C08G77/14C08G77/12C08G77/20C08K5/56C08L83/00C09J7/40B32B27/00C09J2301/312C09J2301/162C09J2301/302B32B7/06B32B7/12B32B27/08B32B2457/20C08G77/08C08G77/16C08G77/22C08G77/80
Inventor 伊藤真树中村昭宏须藤通孝
Owner DOW TORAY CO LTD