Copper-clad plate manufacturing and processing technology
A processing technology and a technology for copper clad laminates, which are applied in the field of copper clad laminate manufacturing and processing technology, can solve the problems of wasting manpower and material resources, low utilization rate of the overall device, and fracture of copper clad laminates, and achieve the effects of saving manpower and material resources, improving utilization efficiency, and avoiding cracks.
Active Publication Date: 2021-04-30
江苏荣进电子有限公司
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Problems solved by technology
[0005] The present invention can solve the traditional manufacturing process of copper clad laminates. When drilling through holes on copper clad laminates, usually only clamp the two sides of the copper clad laminates, and then drill holes. Unstable clamping will cause the copper clad laminates to break Or cracks will also affect the quality of via holes, and usually only a certain type of drilling equipment can be used to drill a specific style of via holes. If you need to drill different via holes in batches, you need to The replacement of the drilling equipment resulted in a low utilization rate of the overall device and a waste of manpower and material resources, etc.
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[0034] The embodiments of the present invention will be described in detail below with reference to the accompanying drawings, but the present invention can be implemented in many different ways defined and covered by the claims.
[0035] like Figure 1 to Figure 6 As shown, a copper-clad laminate manufacturing process adopts the following machine: the machine includes a fixed base 1, a connecting column 2, a mounting base 3, a displacement plate 4 and a drilling device 5, and the upper end of the fixed base 1 is close to Connecting column 2 is evenly installed at four corners, and the upper end of connecting column 2 is connected with installation base 3, and the top of installation base 3 is provided with displacement plate 4, and the lower side of displacement plate 4 is provided with drilling device 5.
[0036]The fixed base 1 includes a fixed base plate 11, a No. 1 lead screw 12, a driving mechanism 13 and a limit frame 14, and a No. 1 lead screw 12 is arranged on the fro...
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The invention relates to a copper-clad plate manufacturing and processing technology. The copper-clad plate manufacturing and processing technology mainly comprises the following steps of equipment installation, plate clamping, unified limiting, drilling treatment and the like. Used processing machinery comprises a fixed base, connecting columns, an installation base, a displacement plate and a drilling device. The connecting columns are evenly installed at the positions, close to the four corners, of the upper end of the fixed base, the installation base is connected to the upper ends of the connecting columns, the displacement plate is arranged above the installation base, and the drilling device is arranged on the lower side of the displacement plate. According to the copper-clad plate manufacturing and processing technology, the problems that when a through hole is drilled in a copper-clad plate, only two sides of the copper-clad plate are clamped and then drilled, the copper-clad plate is fractured or cracked due to unstable clamping, the quality of the through hole is influenced, only a certain drilling device can be fixedly adopted to drill a certain specific type of through hole generally, the utilization rate of the whole device is low, and meanwhile, manpower and material resources are wasted are solved.
Description
technical field [0001] The invention relates to the technical field of plate drilling, in particular to a copper-clad laminate manufacturing process. Background technique [0002] Copper clad laminate is a plate material made by impregnating electronic glass fiber cloth or other reinforcing materials with resin, covering one or both sides with copper foil and hot pressing. Various printed circuit boards of different forms and functions are selectively processed, etched, drilled and copper-plated on the copper clad laminate to make different printed circuits. The copper clad laminate mainly plays the role of interconnection, insulation and support for the printed circuit board, and has a great influence on the transmission speed, energy loss and characteristic impedance of the signal in the circuit. Therefore, the performance and quality of the printed circuit board , processability in manufacturing, manufacturing level, manufacturing cost, and long-term reliability and stab...
Claims
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IPC IPC(8): B26F1/16B26D7/02B26D7/26
CPCB26F1/16B26D7/02B26D7/2614
Inventor 孙栋
Owner 江苏荣进电子有限公司