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High-strength, high-conductivity, high-toughness copper-titanium alloy for integrated circuits and preparation method thereof

A technology of integrated circuits and copper-titanium alloys, which is applied in the field of high-strength, high-conductivity, high-toughness copper-titanium alloys for integrated circuits and its preparation, can solve problems such as inability to achieve sufficient strength, conductivity and toughness, and achieve high-strength, fine-grained crystallized grains and improved plasticity

Active Publication Date: 2021-12-24
WUXI RIYUE ALLOY MATERIALS
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Although the addition of these trace elements has improved the performance of gold to a certain extent, it is not enough to make a qualitative leap in the performance of the alloy because the processing technology of the alloy has not been changed, and it is impossible to improve the performance of the alloy in terms of strength, conductivity and toughness. to a sufficient extent

Method used

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  • High-strength, high-conductivity, high-toughness copper-titanium alloy for integrated circuits and preparation method thereof
  • High-strength, high-conductivity, high-toughness copper-titanium alloy for integrated circuits and preparation method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0023] A method for preparing a high-strength, high-conductivity, high-toughness copper-titanium alloy, the preparation method comprising the steps of:

[0024] (1) Ingredients: Weigh the raw materials, the chemical composition contained in the raw materials and their weight percentages are: 3.0% titanium, 0.18% iron, 0.16% aluminum, 0.05% boron, and the balance is copper and unavoidable impurities; electrolysis Titanium, which provides Ti element; electrolytic iron, which provides Fe element; electrolytic aluminum, which provides Al element; elemental boron, which provides B element; TU2 oxygen-free copper, which provides Cu element;

[0025] (2) Vacuum smelting: put the raw materials weighed in step (1) into vacuum smelting equipment for vacuum smelting, the vacuum degree is 0.5Pa, and the temperature is 1250°C for 25 minutes to form a copper-titanium alloy melt;

[0026] (3) Casting: casting the copper-titanium alloy melt obtained in step (2) into a flat ingot, and quickly ...

Embodiment 2

[0030] A method for preparing a high-strength, high-conductivity, high-toughness copper-titanium alloy, the preparation method comprising the steps of:

[0031] (1) Ingredients: Weigh the raw materials, the chemical composition contained in the raw materials and their weight percentages are: 3.2% titanium, 0.2% iron, 0.18% aluminum, 0.07% boron, and the balance is copper and unavoidable impurities; electrolysis Titanium, which provides Ti element; electrolytic iron, which provides Fe element; electrolytic aluminum, which provides Al element; elemental boron, which provides B element; TU2 oxygen-free copper, which provides Cu element;

[0032] (2) Vacuum smelting: put the raw materials weighed in step (1) into vacuum smelting equipment for vacuum smelting, the vacuum degree is 10Pa, and the temperature is 1250°C for 30 minutes to form a copper-titanium alloy melt;

[0033] (3) Casting: casting the copper-titanium alloy melt obtained in step (2) into a flat ingot, and quickly co...

Embodiment 3

[0037] A method for preparing a high-strength, high-conductivity, high-toughness copper-titanium alloy, the preparation method comprising the steps of:

[0038] (1) Ingredients: Weigh the raw materials, the chemical components contained in the raw materials and their weight percentages are: 3.4% titanium, 0.22% iron, 0.20% aluminum, 0.09% boron, and the balance is copper and unavoidable impurities; electrolysis Titanium, which provides Ti element; electrolytic iron, which provides Fe element; electrolytic aluminum, which provides Al element; elemental boron, which provides B element; TU2 oxygen-free copper, which provides Cu element;

[0039] (2) Vacuum smelting: put the raw materials weighed in step (1) into vacuum smelting equipment for vacuum smelting, the vacuum degree is 0.01Pa, and the temperature is 1350° C. for 20 minutes to form a copper-titanium alloy melt;

[0040] (3) Casting: casting the copper-titanium alloy melt obtained in step (2) into a flat ingot, and quickl...

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Abstract

The invention discloses a high-strength, high-conductivity and high-toughness copper-titanium alloy for integrated circuits. The elements contained in the copper-titanium alloy and the weight percentages of each element are: titanium 2.9-3.4%, iron 0.17-0.23%, aluminum 0.15-0.20 %, boron 0.03-0.10%, and the balance is copper and unavoidable impurities; the preparation method of the high-strength, high-conductivity and high-toughness copper-titanium alloy includes the following steps: (1) batching; (2) vacuum melting to form copper-titanium alloy alloy melt; (3) casting to form an ingot; (4) cold rolling to obtain a plate; (5) aging treatment. The alloy of the invention has the advantages of high strength, good electrical conductivity and strong toughness, and is mainly used for integrated circuits, especially large-scale and ultra-large-scale integrated circuit frames and connectors of various electronic products.

Description

technical field [0001] The invention relates to the technical field of metal materials, in particular to a high-strength, high-conductivity, high-toughness copper-titanium alloy for integrated circuits and a preparation method thereof. Background technique [0002] Lead frame materials used for integrated circuits and semiconductors at home and abroad are divided into two categories: iron-nickel alloy (Fe42Ni) and copper alloy. Iron-nickel alloys have higher strength and softening temperature, but lower electrical and thermal conductivity, and are mainly used in ceramic and glass packages. Due to the excellent electrical conductivity and low price of copper alloys, the consumption of copper alloy lead frames has accounted for 90% of the total since entering the 21st century. [0003] Copper alloys used in lead frames, various terminals of electronic equipment, connectors, etc. are not only required to have high strength and high conductivity, but also due to the increase in...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C22C9/00C22C1/02C22F1/08
CPCC22C9/00C22C1/02C22F1/08
Inventor 晏弘
Owner WUXI RIYUE ALLOY MATERIALS