Multilayer circuit board and manufacturing method thereof

Abstract

The inventio provides a multilayer circuit board, which comprises a first base material layer, a first conductive circuit layer, a second conductive circuit layer, a second base material layer and a third conductive circuit layer, wherein the first conductive circuit layer and the second conductive circuit layer are formed on two opposite surfaces of the first base material layer, the third conductive circuit layer is formed on the second base material layer, the multilayer circuit board is divided into a first step section and a second step section which are connected, the first step section and the second step section are arranged in a staggered step shape, the first base material layer, the first conductive circuit layer and the second conductive circuit layer are located in the first step section, the second base material layer and the third conductive circuit layer are located in the second step section, the second base material layer and the first base material layer are not on the same layer and are arranged in a staggered step shape, the second base material layer and the second conductive circuit layer are on the same layer, the third conductive circuit layer comprises a first external circuit and a first node circuit; the first node circuit is connected with the first base material layer and the second base material layer and is electrically connected with the first conductive circuit layer, and the first external circuit and the first base material layer are located on the same layer. The invention further relates to a manufacturing method of the multilayer circuit board.

Description

technical field [0001] The invention relates to a multilayer circuit board and a manufacturing method thereof. Background technique [0002] With the development of electronic products to high density, the application of multilayer circuit boards is getting higher and higher. In the prior art, conductive vias are often used for electrical conduction, and the production of conductive vias involves many manufacturing processes, and there is a risk of tearing glue during the manufacturing process of conductive vias. In addition, the method of multilayer lamination and lamination is used to build layers, and then the internal conductive circuit is exposed by the uncapping process. This will cause problems such as poor alignment between layers of the multilayer board, poor uncapping, and poor lamination. Contents of the invention [0003] In view of this, it is necessary to provide a multi-layer circuit board that can avoid glue tearing, poor alignment between layers, poor ope...

AI Technical Summary

Problems solved by technology

In the prior art, conductive vias are often used for electrical conduction. The production of conductive vias involves many production processes, and there is a risk of tearing glue during the production of conductive vias.

In addition, the method of multi-layer lamination and lamination is used to increase the layers, and then the internal conductive circuit is exposed by the uncapping process. In this way, problems such as poor alignment between layers of the multilayer board, poor uncapping, and poor lamination will be caused.

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