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Organosilicone gel composition and preparation method thereof

A technology of silicone gel and composition, which is applied in the field of silicone gel composition and its preparation, can solve the problems of high thermal conductivity gel filler ratio, affecting production efficiency, poor processing performance, etc., to achieve improved compatibility, The effect of improving production efficiency and increasing extrusion rate

Active Publication Date: 2021-05-07
SHENZHEN ANPIN SILICONE MATERIAL
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0006] Aiming at the deficiencies of the above-mentioned prior art, the present invention provides a silicone gel composition and its preparation method, which solves the problem of slow extrusion of the existing high thermal conductivity gel due to the high proportion of fillers, affecting production efficiency, and poor processability. question

Method used

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  • Organosilicone gel composition and preparation method thereof
  • Organosilicone gel composition and preparation method thereof
  • Organosilicone gel composition and preparation method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 11

[0060] Add 250g of the modified base polymer of Example 1 into a 5L planetary mixer, add 550g of 40μm spherical magnesium oxide, 150g of 10μm spherical alumina, 350g of 5μm spherical alumina, 3.9g of hydrogen-containing silicone oil (the dynamic viscosity value at 25°C is 50mpa·s , hydrogen content is 0.18%), inhibitor tetramethyltetravinyl cyclotetrasiloxane 0.3g, stirred for 30min and vacuumed (vacuum degree <0.01MPa) After continuing to stir for 1h, add 3g of platinum content and be 500ppm chloroplatinic acid The complex was stirred for 30 minutes under vacuum (vacuum degree <0.01MPa), and then stopped to discharge the material to obtain a thermally conductive gel.

Embodiment 12

[0062] Add 250g of the modified base polymer of Example 2 into a planetary mixer, add 700g of 90μm spherical magnesium oxide, 300g of 40μm spherical alumina, 750g of 5μm spherical alumina, 4.5g of hydrogen-containing silicone oil (the dynamic viscosity value at 25°C is 50mpa·s, The hydrogen content is 0.18%), the inhibitor tetramethyltetravinylcyclotetrasiloxane 0.3g, stirred for 30min and vacuumed (vacuum <0.01MPa), continued to stir for 1h, and added 3g of platinum with a platinum content of 500ppm for complexation with chloroplatinic acid Stir for 30 minutes under vacuum (vacuum degree <0.01MPa), stop the machine and discharge to obtain a thermally conductive gel.

Embodiment 13

[0064] Add 208g of the modified base polymer of Example 3 into a 5L planetary mixer, add 1000g of 90μm spherical aluminum nitride, 500g of 40μm spherical alumina, 1291g of 5μm spherical alumina, and 7.67g of hydrogen-containing silicone oil (25°C dynamic viscosity value is 200mpa· s, hydrogen content is 0.54%), inhibitor tetramethyltetravinylcyclotetrasiloxane 0.3g, stirred for 30min and vacuumed (vacuum <0.01MPa) and continued to stir for 1h, adding 3g of platinum with a platinum content of 500ppm chloroplatinic acid The complex was stirred for 30 minutes under vacuum (vacuum degree <0.01MPa), and then stopped to discharge the material to obtain a thermally conductive gel.

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Abstract

The invention discloses an organosilicon gel composition which comprises (A) 3-80 parts by weight of a modified base polymer and (B) 20-97 parts by weight of a functional powder material, wherein the total weight part of the modified base polymer (A) and the functional powder material (B) is 100 parts; and (C) an organohydrogenpolysiloxane, (D) an inhibitor, and (E) a catalyst. By preparing the modified base polymer, the compatibility of the base polymer and the filler in the composition can be remarkably improved so that the viscosity is reduced, and the extrusion rate is increased.

Description

technical field [0001] The invention belongs to the technical field of organic silicon materials, and relates to an organic silicon gel composition and a preparation method thereof. [0002] technical background [0003] With the further development of science and technology, the high degree of integration in the field of electronic products, the arrival of the era of 5G communication and the Internet of Everything, the introduction of high frequency, the upgrade of hardware components, and the exponential increase in the number of networked devices and antennas, resulting in the power consumption of equipment Electronic products, including high-power electronics, new energy vehicles, 5G communication equipment, etc., will face increasingly difficult heat dissipation problems. [0004] The key material to solve this problem is thermal interface material. High thermal conductivity gel is a new type of industrial material, which is designed according to the heat conduction req...

Claims

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Application Information

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IPC IPC(8): C08L83/07C08L83/05C08K13/04C08K3/28C08K3/08C08K3/22C08K7/18C08G77/38C08G77/06
CPCC08L83/04C08G77/38C08G77/06C08L2205/025C08K2201/011C08K2003/222C08K2003/2227C08K2003/282C08K2003/085C08K2003/0806C08K2201/005C08K2201/014C08K13/04C08K3/28C08K3/08C08K3/22C08K7/18Y02E60/10
Inventor 梁亮梁悄王刚苏剑
Owner SHENZHEN ANPIN SILICONE MATERIAL