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Signal switching structure and hardware-in-loop simulation test system

A transfer and signal technology, applied in general control systems, electrical testing/monitoring, control/regulation systems, etc., can solve problems such as the inability to realize the connection of PIN pins and the inability to realize arbitrary configuration of PIN pins

Active Publication Date: 2021-05-07
HUAWEI TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] figure 1 In the BOB shown, the connection between PIN pin a1 and other PIN pins in terminal β cannot be realized, that is to say, any configuration of PIN pins between terminal α and terminal β cannot be realized

Method used

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  • Signal switching structure and hardware-in-loop simulation test system
  • Signal switching structure and hardware-in-loop simulation test system
  • Signal switching structure and hardware-in-loop simulation test system

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0130] Such as Figure 21 As shown, in the first group of wiring boards A and the second group of wiring boards B, there are two wiring boards. In the first group of wiring boards A, there are a first wiring board 11 and a third wiring board 13. The second wiring board B includes the second wiring board 12 and the fourth wiring board 14, and the third wiring board 13, the first wiring board 11, the second wiring board 12 and the fourth wiring board 14 are stacked sequentially from top to bottom layout.

[0131] For example, combining Figure 21 , when there are 8 PIN pins on the terminal α, 4*4 first openings are provided on the first terminal board 11 and the third terminal board 13, wherein, 4 PIN pins in the 8 PIN pins are connected with The first wiring board 11 is connected, and other 4 PIN pins in 8 PIN pins are connected with the 3rd wiring board 13, when there are 8 PIN pins on the connecting terminal β, the second wiring board 12 and the 4th wiring board 14 There a...

Embodiment 2

[0140] Such as Figure 24 As shown, the first group of wiring boards A includes the first wiring board 11, the second group of wiring boards B includes the second wiring board 12 and the third wiring board 13, and the first wiring board 11, the second wiring board The board 12 and the third wiring board 13 are stacked sequentially from top to bottom.

[0141] For example, combining Figure 24 , when there are 48 PIN pins on the terminal α, the first terminal board 11 is provided with 48*48 first openings, and when there are 48 PIN pins on the terminal β, the second terminal board 12 and the third terminal board 13 are provided with 48*24 second openings, wherein 24 of the 48 PIN pins are connected to the second wiring board 12, and the other 24 of the 48 PIN pins are connected to the third wiring board. Board 13 is connected.

[0142] Figure 25 An exploded view of three wiring boards and a lead-through 3 is shown, and the lead-through 3 includes a first insulating segment...

Embodiment 3

[0148] Such as Figure 27 As shown, the first group of wiring boards A includes the first wiring board 11, the second group of wiring boards B includes the second wiring board 12 and the third wiring board 13, and the first wiring board 11, the first wiring board The board 12 and the third wiring board 13 are stacked sequentially from top to bottom.

[0149] Figure 27 The structure shown with Figure 22 The difference of the shown structure is: in the first wiring board 11 , the first sleeve in each first opening forms a first segment and a second segment.

[0150] For example, combining Figure 27 , when there are 48 PIN pins on the terminal α and 48 PIN pins on the terminal β, the first terminal board 11 is provided with 24*48 first openings, the second terminal board 12 and the third terminal board 14 There are 48*48 second openings on the top, wherein 24 of the 48 PINs are connected to the second wiring board 12, and the other 24 of the 48 PINs are connected to the th...

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Abstract

The embodiment of the invention provides a signal switching structure and a hardware-in-the-loop simulation test system, and relates to the technical field of test equipment. The signal switching structure comprises a first wiring board and a second wiring board which are arranged in a stacked mode, metal wires are formed on the first wiring board and the second wiring board, the metal wire on the first wiring board is used for being connected with a pin on a first wiring terminal, and the metal wire on the second wiring board is used for being connected with a pin on a second wiring terminal; the first wiring board is provided with a plurality of first holes, and the second wiring board is provided with a plurality of second holes; any sleeve is made of a conductive material, a first sleeve is sleeved in any first hole, a second sleeve is sleeved in any second hole, the metal wire on the first wiring board is connected with the first sleeve, and the metal wire on the second wiring board is connected with the second sleeve. The conduction piece can move in the axial direction of the first sleeve and the second sleeve which are communicated so that the first sleeve and the second sleeve can be connected or disconnected.

Description

technical field [0001] The present application relates to the technical field of test equipment, in particular to a signal transfer structure and a hardware-in-the-loop simulation test system. Background technique [0002] In the development process of some electronic control equipment such as automobiles and aerospace, hardware-in-loop (Hardware-In-Loop, HIL) simulation testing has become a very important part of the electronic control unit (Electronic Control Unit, ECU) development process. This shortens development time and reduces costs, while at the same time improving the software quality of the ECU. In the HIL test of the ECU, interface configuration and wire harness production are necessary links for the HIL test according to the ECU interface and the I / O board capabilities of the HIL cabinet. [0003] At present, the signal configuration box (Break-Out-Box, BOB) is connected in series between the ECU and the I / O board, and the I / O resources of the I / O board can be ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G05B17/02G05B23/02H01R31/06
CPCH01R31/065G05B23/02G05B17/02
Inventor 王辉孙坚董云飞孙呈祥眭加彩
Owner HUAWEI TECH CO LTD