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Wiring board and method for manufacturing wiring board

A technology of wiring board and manufacturing method, applied in the direction of printed circuit manufacturing, devices that make antennas work in different bands at the same time, antennas, etc.

Pending Publication Date: 2021-05-07
DAI NIPPON PRINTING CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0009] In conventional film antennas, a wiring pattern region (conductor mesh layer) is mounted on a transparent substrate, but the wiring pattern region is easily visible with the naked eye due to the mesh shape of the wiring pattern region

Method used

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  • Wiring board and method for manufacturing wiring board
  • Wiring board and method for manufacturing wiring board
  • Wiring board and method for manufacturing wiring board

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Embodiment Construction

[0039] First, through Figure 1 to Figure 12 One embodiment will be described. Figure 1 to Figure 12 It is a figure which shows this embodiment.

[0040] Each figure shown below is a figure shown schematically. Therefore, the size and shape of each part are appropriately exaggerated for easy understanding. In addition, implementation can be appropriately changed without departing from the technical idea. In addition, in each figure shown below, the same code|symbol is attached|subjected to the same part, and a part of detailed description may be omitted. In addition, numerical values ​​such as dimensions and material names of each member described in this specification are examples of embodiments, are not limited thereto, and can be appropriately selected and used. In the present specification, terms defining shapes and geometric conditions, such as terms such as parallel, perpendicular, and perpendicular, include substantially the same states in addition to strict meanin...

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PUM

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Abstract

A wiring board (10) according to the present invention comprises: a transparent substrate (11); and a wiring pattern region (20) that is disposed on the substrate (11) and includes a plurality of wirings (21, 22). The wiring pattern region (20) has a sheet resistance value of 5 Omega / or less, and the wirings (21, 22) have a maximum width of 3 [mu]m or less when viewed at a viewing angle of 120 degrees.

Description

technical field [0001] Embodiments of the present disclosure relate to a wiring board and a method of manufacturing the wiring board. Background technique [0002] Currently, portable terminal devices such as smartphones and tablet PCs are becoming more and more functional, miniaturized, thinner, and lighter in weight. These portable terminal devices require a plurality of antennas corresponding to communication frequency bands in order to use a plurality of communication frequency bands. For example, antennas for telephones, WiFi (Wireless Fidelity) antennas, 3G (Generation: third-generation digital communications) antennas, 4G (Generation: fourth-generation digital communications) antennas, An antenna for LTE (Long Term Evolution), an antenna for Bluetooth (registered trademark), and an antenna for NFC (Near Field Communication) are provided. However, with the miniaturization of portable terminal devices, the mounting space of the antenna is limited, and the degree of fr...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01Q1/38H05K9/00
CPCH01Q1/38H01Q1/243H01Q9/285H01Q5/307H05K1/0274H05K2201/10098H05K2201/0108H05K3/282H05K3/285H05K3/108H05K3/188H05K2201/0341H05K2201/098H05K2201/09827H05K2203/0557H05K2203/0594H05K2203/0723H05K2203/1338H05K3/281H05K1/0296H05K3/10H05K1/09
Inventor 铃木纲一武诚司松浦大辅
Owner DAI NIPPON PRINTING CO LTD