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Modularized ruggedized computer with air-cooling heat dissipation function

A reinforced computer and modular technology, applied in the computer field, can solve the problems of long fan module replacement, poor maintainability, inconvenient operation and maintenance, etc., and achieve the effects of convenient maintenance, reducing dust entry, and improving heat dissipation efficiency

Active Publication Date: 2021-05-11
HUNAN XING TIAN ELECTRONICS TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0002] The heat dissipation, electromagnetic shielding and dustproof schemes of the existing electronic equipment such as computers or servers are basically by adding fans at the positions of the front and rear cover plates of the chassis or adding fans at the positions of the upper and lower cover plates, and adding corresponding air ducts and air deflectors inside the chassis. At the same time, air inlet and outlet holes are opened on the corresponding side, and components such as shielding waveguide structure (to ensure good electromagnetic shielding performance of the whole machine equipment) and dust-proof filter (to ensure the dustproof effect of the whole machine equipment and the air inlet and outlet positions) are added. , to realize the forced air cooling and heat dissipation of the internal modules of the chassis and the whole equipment, so as to ensure that the functional modules in electronic equipment such as computers or servers can still work normally when the ambient temperature is above 55°C; in addition, the existing hardened computers or hardened servers For electronic equipment such as products, generally the front cover of the case has to be removed to insert or replace the functional modules inside the case, which is inconvenient for operation and maintenance; the replacement of the fan module takes a long time, and the device needs to be powered off first Operation, only after removing the front and rear covers and top and bottom covers of the chassis can a single fan or module be replaced, poor maintainability

Method used

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  • Modularized ruggedized computer with air-cooling heat dissipation function
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Embodiment Construction

[0031] Embodiments of the present invention are described in detail below, examples of which are shown in the drawings, wherein the same or similar reference numerals designate the same or similar elements or elements having the same or similar functions throughout. The embodiments described below by referring to the figures are exemplary only for explaining the present invention and should not be construed as limiting the present invention.

[0032] In describing the present invention, it should be understood that the terms "center", "longitudinal", "transverse", "length", "width", "thickness", "upper", "lower", "front", " Rear", "Left", "Right", "Vertical", "Horizontal", "Top", "Bottom", "Inner", "Outer", "Axial", "Radial", "Circumferential" The orientation or positional relationship indicated by etc. is based on the orientation or positional relationship shown in the drawings, and is only for the convenience of describing the present invention and simplifying the descriptio...

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Abstract

The invention discloses an air-cooled heat dissipation modular ruggedized computer, comprising: a shell, the top and the front side of which are in an open state; the inner shell is installed in the outer shell, the front side of the inner shell is open and corresponds to the front side of the outer shell, a heat dissipation air channel is formed between the left side of the inner shell and the inner wall of the outer shell, and an air outlet corresponding to the heat dissipation air channel is formed in the rear side wall of the outer shell; a wiring area is formed between the rear side of the inner shell and the inner wall of the outer shell; the fan module is mounted on the front side of the heat dissipation air duct and detachably connected with the shell; the top cover plate is pressed on the inner shell, is connected with the outer shell and is used for sealing the top of the outer shell; and the functional modules are connected with the outer shell and partially inserted into the inner shell, and the multiple functional modules seal the front side of the inner shell. According to the modularized ruggedized computer with the air cooling heat dissipation function, modularized design is adopted for all the parts, installation and operation are easy, maintenance is convenient, and the heat dissipation efficiency is high; all the modules are tightly installed, and use is firm and convenient.

Description

technical field [0001] The invention relates to the field of computers, in particular to an air-cooled and heat-dissipating modular reinforced computer. Background technique [0002] The heat dissipation, electromagnetic shielding and dustproof schemes of the existing electronic equipment such as computers or servers are basically by adding fans at the positions of the front and rear cover plates of the chassis or adding fans at the positions of the upper and lower cover plates, and adding corresponding air ducts and air deflectors inside the chassis. At the same time, air inlet and outlet holes are opened on the corresponding side, and components such as shielding waveguide structure (to ensure good electromagnetic shielding performance of the whole machine equipment) and dust-proof filter (to ensure the dustproof effect of the whole machine equipment and the air inlet and outlet positions) are added. , to realize the forced air cooling and heat dissipation of the internal ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G06F1/18G06F1/20
CPCG06F1/183G06F1/20
Inventor 陈桂勇王天邦陈军官茂彭伟
Owner HUNAN XING TIAN ELECTRONICS TECH