Diamond fretsaw surface abrasive particle distribution uniformity evaluation method
A technology of diamond wire sawing and distribution uniformity, which is applied in image analysis, image enhancement, instruments, etc.
Active Publication Date: 2021-05-14
SHANDONG UNIV
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Problems solved by technology
[0004] In order to solve the problem of evaluating the uniformity of abrasive particle distribution on the surface of diamond wire saw, this method provides a method for evaluating the uniformity of abrasive particle distribution on the surface of diamond wire saw
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experiment example
[0053]Experimental example: Taking a diamond wire saw with a wire diameter of 160 μm as an example, the Voronoi diagram obtained based on the expanded image of the diamond wire saw surface is as follows Figure 4 shown.
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The invention provides a diamond fretsaw surface abrasive particle distribution uniformity evaluation method, and relates to the field of diamond fretsaw surface quality detection and evaluation. According to the method, on the basis of an existing diamond fretsaw surface expansion image, Gaussian filtering and gamma transformation are used for preprocessing the image, the gravity center position of abrasive particles in the image is obtained through global adaptive binaryzation, connected domain searching and other methods, Voronoi subdivision is conducted on the image with the gravity center position as a seed point, and a Voronoi image is obtained; and further the area of each small region in the Voronoi diagram is corrected, and a characterization method for the distribution uniformity of the abrasive particles on the surface of the diamond fretsaw is disclosed on the basis. According to the method, evaluation parameters are provided for the distribution uniformity of the abrasive particles on the surface of the diamond fretsaw, quantitative evaluation on the uniformity of the abrasive particles is achieved, a surface quality evaluation system of the diamond fretsaw is perfected, and the method has a guiding value for production and application of the diamond fretsaw.
Description
technical field [0001] The invention provides a method for evaluating the distribution uniformity of abrasive grains on the surface of a diamond wire saw, and relates to the field of detection and evaluation of the surface quality of a diamond wire saw. Background technique [0002] Diamond wire saw has the advantages of high processing efficiency and small kerf, and is widely used in the field of slicing of hard and brittle materials such as single crystal silicon, sapphire, single crystal silicon carbide, and ceramics. At present, the main indicators for evaluating the surface quality of diamond wire saws are: diameter, breaking force, the number of abrasive grains per unit length, and the height of abrasive grains. In addition to these parameters, the uniformity of abrasive particle distribution on the surface of the diamond wire saw will also have an important impact on its slicing efficiency and processing quality, but there are no parameters and methods that can quanti...
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IPC IPC(8): G06T7/00G06T7/11G06T7/62G06T7/66
CPCG06T7/0004G06T7/11G06T7/62G06T7/66G06T2207/10004
Inventor 毕文波赵玉康葛培琪
Owner SHANDONG UNIV



