Alignment method and alignment system
A technology for checking and calibrating devices, which is applied in the fields of electrical components, semiconductor/solid-state device manufacturing, circuits, etc., and can solve problems affecting bonding efficiency, etc.
Pending Publication Date: 2021-05-25
SHENYANG KINGSEMI CO LTD
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However, the misalignment correction of this application is carried out during the formation of the interlayer pattern layer, which will affect the bonding efficiency
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[0038] In order to make the purpose, technical solutions and advantages of the embodiments of the present invention clearer, the technical solutions in the embodiments of the present invention will be clearly and completely described below. Obviously, the described embodiments are part of the embodiments of the present invention, not all of them. the embodiment. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without creative efforts fall within the protection scope of the present invention. Unless otherwise defined, the technical terms or scientific terms used herein shall have the usual meanings understood by those skilled in the art to which the present invention belongs. As used herein, "comprising" and similar words mean that the elements or items appearing before the word include the elements or items listed after the word and their equivalents, without excluding other elements or items.
[0039] ...
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The invention provides an alignment method, which comprises the following steps of: adjusting an image acquisition part to enable two substrates to be opposite, simultaneously acquiring initial edge position information and initial feature mark position information of the two substrates through the image acquisition part, and sending calibration information obtained by checking and calculating to a guide part of a calibration device through a main control part, wherein the guide part performs compensation adjustment according to the calibration information. According to the alignment method provided by the invention, before bonding, the image acquisition part simultaneously acquires the initial edge position information and the initial feature mark position information of the two substrates and then sends the information to the main control part for checking calculation, so that the accuracy of the acquired corresponding position information is ensured; and the calibration information obtained through checking calculation is sent to the guide part of the calibration device by combining with the main control part, and the guide part performs compensation adjustment according to the calibration information to realize alignment adjustment before bonding. The invention also provides an alignment system for realizing the alignment method.
Description
technical field [0001] The invention relates to the technical field of semiconductor equipment, in particular to an alignment method and an alignment system. Background technique [0002] The wafer alignment system is one of the indispensable key components of wafer bonding equipment, and it is a necessary condition to ensure that the bonded wafer group can accurately carry out subsequent process steps. [0003] The patent application with the publication number CN109920751A discloses a system for correcting the alignment deviation of wafer bonding by using lithographic exposure compensation. The alignment deviation of the bonding pattern layer is corrected. However, the alignment deviation correction in this application is performed during the formation of the interlayer pattern layer, which will affect the bonding efficiency. [0004] Therefore, it is necessary to develop a novel alignment method to solve the above-mentioned problems existing in the prior art. Contents...
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IPC IPC(8): H01L21/68
CPCH01L21/681
Inventor 温海涛王绍勇王连胜康颖张健
Owner SHENYANG KINGSEMI CO LTD