Multilayer printed circuit board facilitating heat dissipation
A printed circuit board and circuit board technology, which is applied to printed circuit components, circuit heating devices, electrical components, etc., can solve the problems of unsatisfactory heat dissipation of high-calorie multilayer printed circuit boards and inconvenient replacement of heat dissipation components. , to achieve the effect of improving heat dissipation, facilitating replacement and installation, and improving air permeability
Active Publication Date: 2021-05-28
广德展新电子科技有限公司
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Problems solved by technology
[0003] A Chinese patent discloses a fast heat dissipation printed circuit board (authorized announcement number CN211019837U). This patented technology can achieve the purpose of conveniently replacing the cooling liquid through water cooling, thereby improving the use efficiency of heat dissipation printed circuit boards, and further improving It improves the practicability of heat dissipation printed circuit boards, but its heat dissipation for high heat multilayer printed circuit boards is not ideal, and it is inconvenient to replace heat dissipation components
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[0023] see Figure 1~6 , in an embodiment of the present invention, a multi-layer printed circuit board that is conducive to heat dissipation includes a circuit board body 1, mounting holes 3 are opened at the four corners of the circuit board body 1, and a heat dissipation mechanism 2 is installed on the upper end of the circuit board body 1, The lower end of the mounting hole 3 is fixedly connected with the support pipe 4, the heat dissipation mechanism 2 includes an air-cooled heat dissipation assembly 21, and one end of the air-cooled heat dissipation assembly 21 is fixedly connected with a first fin heat dissipation plate 22, and the other end of the air-cooled heat dissipation assembly 21 One end is fixedly connected with the second fin cooling plate 25 by screws, and the bottom end of the first fin cooling plate 22 is connected with the first water cooling cooling component 23 by screws on the side away from the air-cooling heat dissipation assembly 21, and the second fi...
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The invention relates to the technical field of circuit boards, and discloses a multilayer printed circuit board facilitating heat dissipation, which comprises a circuit board body. A heat dissipation mechanism is arranged at the upper end of the circuit board body, the heat dissipation mechanism comprises an air-cooled heat dissipation assembly, one end of the air-cooled heat dissipation assembly is fixedly connected with a first fin heat dissipation plate through a screw, and the side, away from the air-cooled heat dissipation assembly, of the bottom end of the first fin heat dissipation plate is fixedly connected with a first water-cooled heat dissipation assembly through screws. A heat dissipation mechanism of the multilayer printed circuit board is composed of the air-cooled heat dissipation assembly, the first fin heat dissipation plate, the first water-cooled heat dissipation assembly, the second water-cooled heat dissipation assembly and the second fin heat dissipation plate, and a heat dissipation motor of the air-cooled heat dissipation assembly drives axial flow fan blades to rotate at a high speed; the water-cooled flat tubes in the first water-cooled heat dissipation assembly and the second water-cooled heat dissipation assembly can take away a part of heat through circulating water, so that the heat dissipation effect of the circuit board body can be greatly improved.
Description
technical field [0001] The invention relates to the technical field of circuit boards, in particular to a multilayer printed circuit board which is good for heat dissipation. Background technique [0002] For electronic equipment, a certain amount of heat will be generated during work, which will cause the internal temperature of the equipment to rise rapidly. If it is not dissipated in time, the equipment will continue to heat up, the device will fail due to overheating, and the reliability of the electronic equipment will decline. Therefore, it is very important to carry out heat dissipation treatment on the circuit board. Among them, the multilayer printed circuit board has the characteristics of high assembly density, small size, shortened connection between electronic components, improved signal transmission speed, and convenient wiring. Therefore, its Unit area will generate more heat. [0003] A Chinese patent discloses a fast heat dissipation printed circuit board (...
Claims
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Patent Timeline
Login to View More IPC IPC(8): H05K1/02H05K7/20
CPCH05K1/0209H05K7/20136H05K7/205
Inventor 王建超
Owner 广德展新电子科技有限公司