Forming system for semiconductor material machining

Abstract

The invention discloses a forming system for semiconductor material machining and relates to the technical field of semiconductor material machining equipment. The forming system for semiconductor material machining comprises a bottom plate, a box body is fixedly connected to the top of the bottom plate, a heating device is arranged in the center of the top of the box body, and a second movable block is fixedly connected to the side, away from a first movable block, of a connecting plate, and protection boxes are fixedly connected to the tops of the first movable block and the second movable block. Driving mechanisms are arranged in the protection boxes, forming devices are arranged on the tops of the protection boxes, and material taking mechanisms are arranged on the left rear portion and the right front portion of the top of the box body. According to the forming system for semiconductor material machining, two workpieces can be formed at a time, the working efficiency can be better improved, a flow guide mechanism can increase the speed of water flow in a movable frame, and therefore the temperature difference of cooling liquid between different positions in the movable frame is reduced, the workpieces are cooled more evenly, the workpieces are not likely to deform during material taking, and the finished product machining quality is better improved.

Description

technical field [0001] The invention relates to the technical field of semiconductor material processing equipment, in particular to a molding system for semiconductor material processing. Background technique [0002] A semiconductor is a substance with an electrical conductivity between an insulator and a conductor. Its electrical conductivity is easy to control and can be used as a component material for information processing. From the perspective of technology or economic development, semiconductors are very important. The core units of many electronic products, such as computers, mobile phones, and digital tape recorders, use semiconductor conductivity changes to process information. Semiconductor materials are a class of semiconducting properties (conductivity is between conductors and insulators, and the resistivity is about In the range of 1mΩ·cm~1GΩ·cm), it can be used to make electronic materials for semiconductor devices and integrated circuits. In the process o...

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Problems solved by technology

[0007] Aiming at the deficiencies of the prior art, the present invention provides a molding system for semiconductor material processing, which solves the problem that the number of semiconductor materials to be molded in one time is small, and the retrieving process and unloading process cannot be carried out at the same time. Low efficiency, and uneven cooling of the workpiece, resulting in easy deformation when taking out the material, affecting the quality of the finished product

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