Heat dissipation structure and vehicle-mounted charger

Abstract

The invention provides a heat dissipation structure and a vehicle-mounted charger. The heat dissipation structure comprises a pedestal, a heat dissipation water channel which extends upwards from the pedestal, a PCB which is located above a substrate and is electrically connected with a power device, and a substrate which is installed on the side surface of the heat dissipation water channel and is provided with at least one power device. According to the heat dissipation structure and the vehicle-mounted charger provided by the invention, the three-dimensional design that the heat dissipation water channel is perpendicular to the substrate and parallel to the PCB is adopted, so that the plane and space utilization rate of the water channel is effectively improved; by combining the heat-conducting property and compact volume of the metal substrate, signal transmission and overall power density are guaranteed, the heat dissipation efficiency and the overall space utilization rate of the power device are improved, and integration, miniaturization and light weight of the vehicle-mounted charger are facilitated; the power device replaces a plug-in unit with surface mounting, so that the consistency is better; and pins are directly arranged on the top end face of the metal substrate, power transmission is achieved, the area is saved, and the effective heat dissipation area of the metal substrate is utilized to the maximum extent.

Description

technical field [0001] The invention relates to the technical field of power device heat dissipation, and more specifically, relates to a water-cooled heat dissipation structure and a vehicle-mounted charger. Background technique [0002] With the development of electronic technology, electronic equipment has been increasingly widely used. At the same time, the power density of electronic equipment continues to increase, and the heating power also increases. Therefore, the problem of heat dissipation has become a major bottleneck restricting the further development of electronic technology. A lot of practice shows that temperature is one of the main reasons for the failure of electronic equipment, and as the temperature increases, the probability of device failure increases exponentially. Electronic equipment needs to work at close to full load for a long time. Under limited conditions, it is a great challenge to solve the heat dissipation problem of such electronic equipme...

AI Technical Summary

Problems solved by technology

[0005] In order to solve the technical problems of the heat dissipation structure of the power device of the existing planarized water channel and the vehicle-mounted charger, the overall space utilization rate of the heat dissipation structure is low, which is not conducive to the improvement of power density and the requirements for miniaturization of product integration, the present invention proposes a technical problem A water-cooled water-cooled structure with high space utilization and high power density is suitable for heat dissipation structures of power devices and on-board chargers

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