Multilayer ceramic capacitor and method of manufacturing the same

Abstract

The invention provides a multilayer ceramic capacitor and a manufacturing method thereof. The base of the ceramic capacitor comprises a ceramic inductive body and a plurality of internal electrodes formed in the ceramic inductive body and arranged in staggered intervals, and external electrode layers are sintered on two sides of the base. two first external electrodes, and the two first external electrodes are in electrical contact with the internal electrode ends of the plurality of internal electrodes, and then a second external electrode made of metal powder and resin is formed outside the two first external electrodes , the inner electrode and the first outer electrode are both nickel powder and barium titanate powder with an average particle size of 0.2 μm to 0.4 μm, which can make the inner electrode and the first outer electrode have good electrical contact and improve mutual bonding. In order to prevent the intrusion of the plating solution, the strength of the first outer electrode is reduced.

Description

technical field [0001] The invention relates to a multilayer ceramic capacitor and a manufacturing method thereof, especially that the inner electrode and the first outer electrodes on both sides of the multilayer ceramic capacitor both contain nickel powder and barium titanate powder with an average particle size of 0.2-0.4 μm , so that the electrical contact between the inner electrode and the first outer electrode is good, and the mutual bonding strength is improved, thereby reducing the peeling. Background technique [0002] Today's electronic products and related electronic equipment all need to use active components and passive components. Among them, the active components (such as IC or CPU) can perform arithmetic processing functions alone, while the passive components are relative to the active components. When the voltage changes, the components whose resistance or impedance will not change with it are generally called the three passive components: Capacitor, Resis...

AI Technical Summary

Problems solved by technology

[0007] Wherein the ceramic dielectric body and the first external electrode made of nickel are around the adjacent joint position, because the sintering temperature is high, it is easy to form a diffusion layer of nickel oxide, so that the bonding strength is improved. However, when making the second external electrode, due to the glass The powder of the material has the characteristics of very high sintering temperature and long sintering time, so it is easy for the glass component to invade the first external electrode and the interior of the ceramic dielectric body by thermal diffusion, and finally reduce the structural strength of the multilayer ceramic capacitor or dielectric body

[0008] In addition, because the second external electrode includes glass powder and silver (or silver alloy) materials at the same time, it is prone to uneven distribution of glass powder. When electroplating the third external electrode, it is easy to cause the electroplating solution (such as: nickel plating solution) to invade the interior of the ceramic dielectric through the diffusion path of the second and first external electrodes, resulting in serious poor density of the multilayer ceramic capacitor , poor quality, fragile texture and easy cracks. If it is applied to electronic products, it will not be able to perform the expected normal functions of multilayer ceramic capacitors, so there are many deficiencies that need to be improved.

[0009] In addition, the prior art multilayer ceramic capacitor generally uses multiple heating or sintering processes to make the layered structure of the external electrodes, but frequent sintering or high temperature heating will cause damage to the capacitor, especially the internal electrodes and the first electrode. An external electrode, in order to produce a high-capacity MLCC and increase the number of internal electrodes stacked, many internal electrodes are gradually becoming thinner, resulting in a much smaller contact area between each layer of internal electrodes and the first external electrode, At this time, if the first external electrode that has been formed is affected by the temperature of the subsequent process and thermal expansion occurs, the original contact position between the first external electrode and the internal electrode will be peeled off, or even damaged or broken, which will affect the electrical characteristics of the capacitor.

[0010] In addition, when making the external electrode or the first external electrode of the MLCC of the prior art, copper-containing metal or copper metal may be selected, but the thermal expansion coefficients of the external electrode and the internal electrode are different due to the different types of materials. If the volume changes, the original contact position between the first external electrode and the internal electrode is also prone to damage

[0011] As mentioned above, there are many problems of the above-mentioned multilayer ceramic capacitors in the existing technology, especially the non-uniform existence of the glass will cause the plating solution to invade the ceramic dielectric body during the forming process of the external electrodes and cause reliability cracking. Therefore, how to solve the problem Layer ceramic capacitors are invaded by the diffusion of glass powder materials or other impurity elements, which is the direction that relevant manufacturers in this field want to study and improve.

Images