Alignment method, alignment device, alignment equipment and computer storage medium

Abstract

The invention provides an alignment method, an alignment device, alignment equipment and a computer storage medium. When an identification point on a second wafer is located in the alignment interval of an alignment piece, the first deformation amount of the first wafer is obtained, the second deformation amount is obtained according to the first deformation amount, the adjustment piece is controlled to deform according to the second deformation amount, and the second wafer is driven to generate a target deformation amount when the adjusting piece deforms, so that the second wafer is matched with the deformation of the first wafer. When the second wafer deforms, the first movement distance of the identification point on the second wafer is obtained according to the target deformation amount, and when the first movement distance is greater than a preset distance, the alignment piece is deviated when aligning the identification point or cannot align the identification point, so that the alignment piece is controlled to move by a second distance relative to the identification point according to the first movement distance, the identification point is enabled to be located in the alignment interval of the alignment piece, the alignment piece aligns the identification point again, the second wafer is enabled to be matched with the deformation of the first wafer, the alignment precision and stability of the alignment piece are improved, and then the bonding quality between wafers is improved.

Description

technical field [0001] The present application belongs to the technical field of semiconductors, and specifically relates to an alignment method, an alignment device, alignment equipment, and a computer storage medium. Background technique [0002] With the continuous development of electronic devices, the electronic devices are now popular among users due to their portability and rich and varied operability. But at the same time, users' expectations and requirements for electronic equipment are getting higher and higher, which greatly increases the demand for semiconductor chips. In the semiconductor manufacturing process, due to the higher and higher integration of semiconductor chips and the smaller critical dimensions, wafer manufacturing is becoming more and more important to the manufacture of semiconductor devices. For example, during the process of wafer processing, affected by many surface films and heat treatment, the wafer will accumulate a lot of stress, resulti...

AI Technical Summary

Problems solved by technology

For example, during the process of wafer processing, affected by many surface films and heat treatment, the wafer will accumulate a lot of stress, resulting in a certain degree of bending and expansion, which will affect the bonding alignment of different wafers

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