Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

HTCC plane printing paste and preparation method thereof

A slurry and plane technology, which is applied in the field of high-temperature multi-layer co-fired ceramic shell production, can solve problems such as difficulty in obtaining stable and uniform slurry, and achieve the effects of improving uniform stability, improving performance, and improving compactness

Active Publication Date: 2021-06-18
JIANGSU PROVINCE YIXING ELECTRONICS DEVICE GENERAL FACTORY
View PDF7 Cites 3 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] However, the traditional planar printing paste is generally prepared by mixing tungsten powder, inorganic phase and organic phase in a certain ratio. However, due to the difference in surface properties between tungsten powder and inorganic phase, if a single dispersant is used, there will be competition for adsorption. phenomenon, making it difficult to obtain a stable and uniform slurry

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • HTCC plane printing paste and preparation method thereof
  • HTCC plane printing paste and preparation method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0036] A HTCC planar printing paste, comprising: 85% tungsten paste, 15% aluminum oxide paste according to weight percentage;

[0037] The composition of the tungsten slurry is: 80% of tungsten powder; 8% of terpineol; 8% of butyl carbitol; 1.5% of soybean lecithin; 2.5% of ethyl cellulose.

[0038] The composition of the alumina slurry is as follows: 80% of alumina; 8% of terpineol; 8% of butyl carbitol; 1.5% of nonylphenol polyoxyethylene ether; 2.5% of ethyl cellulose, modified silicon Limestone powder 2%.

[0039] A method for preparing HTCC planar printing slurry, comprising the following steps:

[0040] 1) Preparation of tungsten slurry: weigh a certain amount of terpineol, butyl carbitol, and soybean lecithin according to the ratio to form a tungsten slurry dispersion solution, and heat the solution to 50°C; add the weighed Ethyl cellulose, after the ethyl cellulose is fully dissolved to form a tungsten slurry carrier; add weighed tungsten powder to the carrier, and d...

Embodiment 2

[0044] A HTCC planar printing paste, comprising: 88% tungsten paste, 12% alumina paste according to weight percentage;

[0045] The composition of the tungsten slurry is: 82% of tungsten powder; 7% of terpineol; 7% of butyl carbitol; 1.5% of soybean lecithin; 2.5% of ethyl cellulose.

[0046] The composition of the alumina slurry is as follows: 82% of alumina; 7% of terpineol; 7% of butyl carbitol; 1.5% of nonylphenol polyoxyethylene ether; 2.5% of ethyl cellulose, modified silicon Limestone powder 5%.

[0047] A method for preparing HTCC planar printing slurry, comprising the following steps:

[0048] 1) Preparation of tungsten slurry: weigh a certain amount of terpineol, butyl carbitol, and soybean lecithin according to the ratio to form a tungsten slurry dispersion solution, and heat the solution to 50°C; add the weighed Ethyl cellulose, after the ethyl cellulose is fully dissolved to form a tungsten slurry carrier; add weighed tungsten powder to the carrier, and disperse...

Embodiment 3

[0052] A HTCC planar printing paste, comprising: 90% tungsten paste and 10% alumina paste according to weight percentage;

[0053] The composition of the tungsten slurry is as follows: tungsten powder 85%; terpineol 5.5%; butyl carbitol 5.5%; soybean lecithin 1.5%; ethyl cellulose 2.5%.

[0054] Wherein the composition of the alumina slurry is: 85% of alumina; 5.5% of terpineol; 5.5% of butyl carbitol; 1.5% of nonylphenol polyoxyethylene ether; 2.5% of ethyl cellulose, modified silicon Limestone powder 3.5%.

[0055] A method for preparing HTCC planar printing slurry, comprising the following steps:

[0056] 1) Preparation of tungsten slurry: weigh a certain amount of terpineol, butyl carbitol, and soybean lecithin according to the ratio to form a tungsten slurry dispersion solution, and heat the solution to 50°C; add the weighed Ethyl cellulose, after the ethyl cellulose is fully dissolved to form a tungsten slurry carrier; add weighed tungsten powder to the carrier, and disp...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The invention discloses HTCC plane printing paste and a preparation method thereof, and relates to the field of high temperature co-fired ceramic shell manufacturing. The HTCC plane printing paste comprises the following components in percentage by weight: 85-95% of tungsten paste and 5-15% of alumina paste. The preparation method comprises the following steps: (1) preparing tungsten paste; (2) preparing aluminum oxide paste; and (3) mixing the tungsten paste and the aluminum oxide paste into plane printing paste. According to the invention, tungsten powder particles adopt soya bean lecithin as a dispersing agent, and aluminum oxide particles adopt nonylphenol polyoxyethylene ether as a dispersing agent, so that competitive adsorption of the tungsten powder particles and the aluminum oxide particles to a single dispersing agent is avoided, and the uniform stability of the plane printing paste is improved; and aluminum oxide particles are introduced into plane printing lecithin, so that a tungsten metal framework is wetted so as to improve the compactness of a metallization layer, and the ceramic substrate is wetted so as to improve the binding force between the metallization layer and the ceramic substrate.

Description

technical field [0001] The invention relates to the technical field of manufacturing high-temperature multilayer co-fired ceramic shells, in particular to a HTCC plane printing paste and a preparation method thereof. Background technique [0002] Screen printing is one of the most basic links in the production of high-temperature co-fired ceramics. The quality of the slurry directly affects its printing effect on green ceramic sheets and sintering performance, which in turn affects the quality of metallization. Among them, the dispersion stability of the slurry becomes the key. When the slurry is not effectively dispersed and aggregates exist, firstly, the screen will be blocked during the screen printing process; secondly, during the sintering process, due to the existence of aggregates, There will be crack-like pores inside the metallization. [0003] However, the traditional planar printing paste is generally prepared by mixing tungsten powder, inorganic phase and organi...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
IPC IPC(8): C04B41/88
CPCC04B41/5133C04B41/88C04B41/4535C04B41/46C04B41/463C04B41/4803C04B41/47C04B41/5031C04B41/4896C04B41/5024
Inventor 汤明川徐梦娇
Owner JIANGSU PROVINCE YIXING ELECTRONICS DEVICE GENERAL FACTORY
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com