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Substrate support plate, substrate processing apparatus including same, and substrate processing method

A technology for processing equipment and support plates, applied to discharge tubes, electrical components, circuits, etc., can solve problems such as reactor and substrate structure pollution

Pending Publication Date: 2021-06-18
エーエスエムアイピーホールディングベーフェー
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Specifically, the films a and b deposited on a part of the side surface 95 and the rear surface 93 of the substrate are peeled off in the subsequent process, thereby causing contamination of the reactor and structures on the substrate

Method used

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  • Substrate support plate, substrate processing apparatus including same, and substrate processing method
  • Substrate support plate, substrate processing apparatus including same, and substrate processing method
  • Substrate support plate, substrate processing apparatus including same, and substrate processing method

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Embodiment Construction

[0040] Reference will now be made in detail to the embodiments, examples of which are illustrated in the accompanying drawings, wherein like reference numerals refer to like elements throughout. In this regard, the present embodiments may have different forms and should not be construed as being limited to the descriptions set forth herein. Accordingly, the embodiments are merely described below, by referring to the figures, to explain aspects of the present description. As used herein, the term "and / or" includes any and all combinations of one or more of the associated listed items. Expressions such as "at least one" when preceding a list of elements modify the entire list of elements and do not modify the individual elements of the list.

[0041] The terminology used herein is for the purpose of describing particular embodiments and is not intended to be limiting of the present disclosure. As used herein, the singular forms "a", "an" and "the" are intended to include the p...

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PUM

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Abstract

A substrate processing apparatus capable of selectively processing a thin film in a bevel region thereof includes a substrate support plate for supporting a substrate to be processed, and the substrate support plate includes an inner portion having an upper surface having an area less than that of the substrate to be processed; and a peripheral portion surrounding the inner portion, wherein an upper surface of the peripheral portion is below the upper surface of the inner portion.

Description

[0001] Cross References to Related Applications [0002] This application is based upon and claims priority under 35 U.S.C. §119 of U.S. Patent Application No. 62 / 942,617 filed December 02, 2019 in the U.S. Patent and Trademark Office, the entire contents of which are hereby incorporated by reference. technical field [0003] One or more embodiments relate to a substrate support plate, and more particularly, to a substrate support plate, a substrate processing apparatus including the substrate support plate, and a substrate processing method using the substrate support plate. Background technique [0004] When the thin film is formed on the substrate, part of the thin film deposited on the upper and lower edges of the substrate may be peeled off in a subsequent process. Therefore, films deposited on the upper and lower edges of the substrate may act as contaminants, such as forming particles in the reaction space, which may lead to increased device failure rates. [0005] ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01J37/32H01L21/67
CPCH01J37/32449H01J37/32715H01L21/67069H01J2237/3343H01L21/02087H01L21/68735H01L21/6875H01L21/68785H01L21/3065H01J37/20H01L21/31122H01J37/3244
Inventor 金大渊金材玹李承桓
Owner エーエスエムアイピーホールディングベーフェー