A method for manufacturing printed circuit boards based on 5G communication
A technology of printed circuit board and manufacturing method, which is applied in the directions of printed circuit, printed circuit manufacturing, printed circuit secondary processing, etc., can solve the problems of high cost, poor dimensional stability, and low pressing efficiency.
Active Publication Date: 2021-07-27
TEAN ELECTRONICS DA YA BAY CO LTD
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Problems solved by technology
[0006] The invention provides a method for manufacturing printed circuit boards based on 5G communication, which solves the problems of low manufacturing efficiency, high cost, poor dimensional stability, conflicts between reducing transmission loss and improving adhesive force, and low lamination efficiency in the existing substrates. question
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[0034] The embodiment of the present invention will be explained in detail below in conjunction with the accompanying drawings. The examples given are only for the purpose of illustration, and cannot be interpreted as limiting the present invention. The accompanying drawings are only for reference and description, and do not constitute the scope of patent protection of the present invention. limitations, since many changes may be made in the invention without departing from the spirit and scope of the invention.
[0035] A method for manufacturing a printed circuit board based on 5G communication provided by an embodiment of the present invention, such as figure 1 As shown, in this embodiment, it includes: inner layer circuit production, lamination process, drilling process, copper sinking electroplating process, outer layer circuit production, wet film process, surface process, post process;
[0036] In inner line making, see figure 2 , image 3 According to the preset typ...
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The invention relates to the technical field of circuit board manufacturing, and provides a method for manufacturing a printed circuit board based on 5G communication. In the manufacture of inner-layer circuits, material cutting and lithography processes are performed according to a preset typesetting method to obtain an inner-layer circuit board; In the lamination process, a plurality of pre-laminated inner-layer circuit boards are pressed together by preheating and fusion rules; the present invention adopts a small-size pattern typesetting and layout of inner-layer circuit boards, which can make full use of the substrate material; The PCS, and each PCS is matched with more than 8 micro-connecting ends, which provides higher supporting force to the PCS, which can effectively prevent the deformation of the PCS; honeycomb copper foil is laid between the two arrays, and the honeycomb-shaped water chestnut is used. , It is not easy to deform, and further solidifies the size of the inner layer circuit board through internal force; thus ensuring dimensional stability, improving copper plating uniformity and product yield. Designing the preheating and melting rules, and pressing a plurality of the pre-laminated inner-layer circuit boards, the yield is high and the production cost is correspondingly reduced.
Description
technical field [0001] The invention relates to the technical field of circuit board production, in particular to a method for producing a printed circuit board based on 5G communication. Background technique [0002] With the advent of the 5G era, and the development of high-performance / intelligence and networking of computers and information communication equipment, it is necessary to transmit and process large-capacity information at a higher speed. Therefore, the transmitted signal tends to be high-frequency gradually, and the high-frequency and high-speed requirements for signal processing and transmission of communication products are becoming more and more stringent. PCB companies have also put forward new requirements for the raw materials of 5G products, and a large number of low DK and high TG substrates such as PTFE / Rogers have been put into production. Although this type of substrate meets the requirements of 5G signal transmission, it still has the following di...
Claims
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IPC IPC(8): H05K3/06H05K3/36H05K3/46H05K3/38H05K3/28
CPCH05K3/06H05K3/36H05K3/4611H05K3/4626H05K3/389H05K3/282
Inventor 郑晓蓉王康兵
Owner TEAN ELECTRONICS DA YA BAY CO LTD