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Glue for coating TV circuit board and preparation method thereof

A circuit board and coating technology, applied in the directions of adhesives, epoxy resin glue, non-polymer adhesive additives, etc., can solve the problems of easy drying and hardening, poor heat resistance, and reducing the protection effect of circuit boards. Uniform distribution, guaranteed protection, enhanced flexibility and toughness

Active Publication Date: 2022-07-08
青岛汇元海泰电子有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] The existing glue used for coating TV circuit boards has poor heat resistance, and it is easy to dry out and harden when used in a high temperature environment, reducing the protective effect on the circuit board

Method used

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  • Glue for coating TV circuit board and preparation method thereof
  • Glue for coating TV circuit board and preparation method thereof
  • Glue for coating TV circuit board and preparation method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0028] The present invention provides a glue solution for coating a TV circuit board, comprising a component A liquid and a component B liquid. Component A liquid, calculated by weight percentage, includes: 48.56% epoxy resin, 5.64% curing agent, 2.15% pyrolytic graphite, 2.56% nanosilica, 41.09% organic solvent; the B component liquid Calculated by weight percentage, it includes: 56.64% polyurethane, 4.50% curing accelerator, 15.43% nanocellulose, 12.25% hexagonal boron nitride microflakes, 11.18% organic solvent;

[0029] The curing agent is dicyandiamide solution, the curing accelerator is 2-methylimidazole, and the organic solvent is N-methylpyrrolidone (NMP), ethylene glycol (EG), n-butanol, and terpineol One or more of them are compounded;

[0030] The present invention also provides a method for preparing a glue solution for coating a TV circuit board. The specific preparation steps are as follows:

[0031]Step 1: According to the above weight percentage, weigh the ep...

Embodiment 2

[0041] The difference from Example 1 is that the liquid of component A, calculated by weight percentage, includes: 50.24% epoxy resin, 6.16% curing agent, 2.65% pyrolytic graphite, 2.74% nano-silica, 38.21% organic solvent; the B component liquid, calculated by weight percentage, includes: 57.26% polyurethane, 5.30% curing accelerator, 17.57% nanocellulose, 12.65% hexagonal boron nitride microflakes, 7.22% organic solvent .

Embodiment 3

[0043] What is different from Examples 1-2 is that the liquid of component A, calculated by weight percentage, includes: 49.40% epoxy resin, 5.90% curing agent, 2.40% pyrolytic graphite, 2.65% nano-silica , 39.65% organic solvent; the B component liquid, calculated by weight percentage, includes: 56.95% polyurethane, 4.90% curing accelerator, 16.50% nanocellulose, 12.45% hexagonal boron nitride microflakes, 9.20% organic solvent.

[0044] Take the TV circuit board coating glue prepared in the above-mentioned embodiment 1-3 and the circuit board coating glue of control group 1, the circuit board coating glue of control group 2, and the circuit of control group 3 respectively. Board coating glue, circuit board coating glue for control group 4 and circuit board coating glue for control group 5, circuit board coating glue for control group 1 are common circuit boards on the market Coating glue, the circuit board coating glue of control group 2 has no pyrolytic graphite compared w...

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PUM

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Abstract

The invention discloses a glue for coating a TV circuit board and a preparation method thereof, and particularly relates to the technical field of circuit board glue, including A component liquid and B component liquid, and the A component liquid includes epoxy resin, curing agent , pyrolytic graphite, nano-silica, organic solvent; B component liquid includes polyurethane, curing accelerator, nano-cellulose, hexagonal boron nitride microflakes, organic solvent. The invention can effectively improve the heat resistance and high temperature resistance of the glue, can effectively ensure the toughness and flexibility of the glue in a high temperature environment and the protection effect on the circuit board, and can avoid the glue solution being coated on the circuit board in a high temperature environment. Dry hardening occurs in the middle, which can effectively combine double modification treatment on the basis of ensuring the performance of epoxy resin itself, can effectively combine double modification treatment on the basis of ensuring the performance of polyurethane itself, can effectively strengthen the liquid of component A and component B Heat resistance and stability of liquids.

Description

technical field [0001] The invention relates to the technical field of circuit board glue, and more particularly, to a glue used for coating a TV circuit board and a preparation method thereof. Background technique [0002] The names of circuit boards are: ceramic circuit board, alumina ceramic circuit board, aluminum nitride ceramic circuit board, circuit board, PCB board, aluminum substrate, high frequency board, thick copper board, impedance board, PCB, ultra-thin circuit board, ultra-thin circuit board Thin circuit boards, printed (copper etching technology) circuit boards, etc. The circuit board makes the circuit miniaturized and intuitive, and plays an important role in the mass production of fixed circuits and the optimization of the layout of electrical appliances. Circuit boards are very common in home appliances. The circuit board is mainly composed of pads, vias, mounting holes, wires, components, connectors, fillings, electrical boundaries, etc. During the pro...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C09J163/00C09J175/04C09J11/08C09J11/04
CPCC09J163/00C09J11/08C09J11/04C08L2201/08C08L2203/206C08K2003/385C08K2201/011C08L75/04C08L1/02C08K3/38C08K3/04C08K7/26
Inventor 荆爱莲王明明
Owner 青岛汇元海泰电子有限公司