Glue for coating TV circuit board and preparation method thereof
A circuit board and coating technology, applied in the directions of adhesives, epoxy resin glue, non-polymer adhesive additives, etc., can solve the problems of easy drying and hardening, poor heat resistance, and reducing the protection effect of circuit boards. Uniform distribution, guaranteed protection, enhanced flexibility and toughness
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Embodiment 1
[0028] The present invention provides a glue solution for coating a TV circuit board, comprising a component A liquid and a component B liquid. Component A liquid, calculated by weight percentage, includes: 48.56% epoxy resin, 5.64% curing agent, 2.15% pyrolytic graphite, 2.56% nanosilica, 41.09% organic solvent; the B component liquid Calculated by weight percentage, it includes: 56.64% polyurethane, 4.50% curing accelerator, 15.43% nanocellulose, 12.25% hexagonal boron nitride microflakes, 11.18% organic solvent;
[0029] The curing agent is dicyandiamide solution, the curing accelerator is 2-methylimidazole, and the organic solvent is N-methylpyrrolidone (NMP), ethylene glycol (EG), n-butanol, and terpineol One or more of them are compounded;
[0030] The present invention also provides a method for preparing a glue solution for coating a TV circuit board. The specific preparation steps are as follows:
[0031]Step 1: According to the above weight percentage, weigh the ep...
Embodiment 2
[0041] The difference from Example 1 is that the liquid of component A, calculated by weight percentage, includes: 50.24% epoxy resin, 6.16% curing agent, 2.65% pyrolytic graphite, 2.74% nano-silica, 38.21% organic solvent; the B component liquid, calculated by weight percentage, includes: 57.26% polyurethane, 5.30% curing accelerator, 17.57% nanocellulose, 12.65% hexagonal boron nitride microflakes, 7.22% organic solvent .
Embodiment 3
[0043] What is different from Examples 1-2 is that the liquid of component A, calculated by weight percentage, includes: 49.40% epoxy resin, 5.90% curing agent, 2.40% pyrolytic graphite, 2.65% nano-silica , 39.65% organic solvent; the B component liquid, calculated by weight percentage, includes: 56.95% polyurethane, 4.90% curing accelerator, 16.50% nanocellulose, 12.45% hexagonal boron nitride microflakes, 9.20% organic solvent.
[0044] Take the TV circuit board coating glue prepared in the above-mentioned embodiment 1-3 and the circuit board coating glue of control group 1, the circuit board coating glue of control group 2, and the circuit of control group 3 respectively. Board coating glue, circuit board coating glue for control group 4 and circuit board coating glue for control group 5, circuit board coating glue for control group 1 are common circuit boards on the market Coating glue, the circuit board coating glue of control group 2 has no pyrolytic graphite compared w...
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