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Heat dissipation assembly and UV-LED module

A technology of heat-dissipating components and heat-dissipating bodies, applied in electrical components, printed circuit parts, electrical equipment structural parts, etc., can solve the problems that the metal plate is difficult to meet the requirements, and it is difficult to dissipate heat, and achieve a good heat dissipation effect. Effect

Inactive Publication Date: 2021-06-29
力普士科技(珠海)有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, for circuit boards equipped with high-power devices such as UV-LED light sources, it is difficult to meet the requirements of the metal plate pasted on the entire surface. The heat generated by high-power devices passes through the insulating substrate and then transferred to the metal plate. radiate out

Method used

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  • Heat dissipation assembly and UV-LED module
  • Heat dissipation assembly and UV-LED module
  • Heat dissipation assembly and UV-LED module

Examples

Experimental program
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Effect test

Embodiment 2

[0033] This embodiment is similar in structure to Embodiment 1, except that the structure of the insulating substrate is different. Such as Figure 5 As shown, the insulating substrate 10 includes two insulating dielectric layers 11, 12, and there is an adhesive material 31 between the two insulating dielectric layers, which can be the same as the adhesive material 31 between the insulating substrate and the metal radiator 20, so that the The process of forming an insulating substrate from two insulating dielectric layers can be combined with the process of combining the metal radiator 20 with the insulating substrate. For example, hot pressing can be used to make the adhesive material fill the gap between the insulating medium layers and the gap between the insulating medium layers and the metal heat sink to bond together. The process of using the hot pressing method is simple and can firmly bond between the insulating medium layers and between the insulating substrate and t...

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Abstract

The invention provides a heat dissipation assembly and a UV-LED module. The heat dissipation assembly comprises a circuit board and an external heat dissipation device, the circuit board and the external heat dissipation device are connected in a bonding mode through a heat conduction bonding layer, the circuit board comprises an insulation substrate and an internal heat dissipation body embedded in the insulation substrate, the external heat dissipation device is provided with a protruding part, the protruding part is located below the internal heat dissipation body, and the protruding part penetrates through the heat conduction bonding layer and is in thermal connection with the built-in heat dissipation body. The heat dissipation assemblyhas the advantage that heat generated by high-power devices such as a UV-LED light source and the like can be quickly dissipated.

Description

technical field [0001] The invention relates to a heat dissipation component and a UV-LED module with the heat dissipation component. Background technique [0002] UV curing equipment uses ultraviolet rays to irradiate UV-curable materials (such as UV-curable glue or ink) to cause the material to undergo a polymerization reaction and cure. It has a very wide range of applications in printing, coating and other industries. [0003] Multiple UV-LED point light sources are arranged on the circuit board according to certain rules. During the process of converting electrical energy into light energy by UV-LED, part of the electrical energy is inevitably converted into heat energy. When the UV-LED light source works for a long time, the UV -LEDs and other devices on the circuit board will generate a lot of heat, which requires the circuit board to have a strong heat dissipation capability, otherwise it will affect the service life of UV-LEDs. In order to improve the heat dissipat...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K1/02H05K7/20B32B9/04B32B15/04B32B15/20B41F23/04B41J11/00
CPCB32B9/041B32B15/04B32B15/20B32B2250/40B32B2307/206B32B2307/302B32B2457/08B41F23/0409B41F23/0453B41J11/002H05K1/021H05K7/205
Inventor 李保忠
Owner 力普士科技(珠海)有限公司