Solder ball manufacturing equipment and processing technology for a wafer-packaged chip
A technology for wafer packaging and manufacturing equipment, applied in semiconductor/solid-state device manufacturing, semiconductor devices, electrical components, etc., can solve problems such as defects in solder balls, achieve the effects of reducing pores and accelerating exhaust
Active Publication Date: 2021-11-09
金易芯半导体科技(嘉兴)有限公司
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- Application Information
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Problems solved by technology
[0004] Aiming at the deficiencies of the prior art, the purpose of the present disclosure is to provide a solder ball manufacturing equipment for wafer-packaged chips and its processing technology, which solves the problem of solder balls near the pouring port after casting in the prior art. There will be defects in the position
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[0037] The following will clearly and completely describe the technical solutions in the embodiments of the present disclosure with reference to the accompanying drawings in the embodiments of the present disclosure. Apparently, the described embodiments are only some of the embodiments of the present disclosure, not all of them. Based on the embodiments in the present disclosure, all other embodiments obtained by persons of ordinary skill in the art without creative efforts fall within the protection scope of the present disclosure.
[0038] Such as figure 1 As shown, a solder ball manufacturing equipment for a wafer package chip includes a base plate 1, and a feed assembly 2 is installed on the upper end of the base plate 1, such as figure 2 As shown, the feed assembly 2 includes a support frame 21, the support frame 21 is fixedly installed on the upper end of the base plate 1, the upper end of the support frame 21 is fixedly equipped with a feed pipe 22, and the upper end ...
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The invention discloses a solder ball manufacturing equipment for a wafer packaged chip and a processing technology thereof, belonging to the field of solder ball production; a solder ball manufacturing device for a wafer packaged chip includes a fixed mold, a movable mold, a pin rod, a push rod, a lower Pressing mechanism, locking mechanism and polishing mechanism; Exhaust is realized by matching the pin rod in the fixed mold, and the demoulding of the solder ball is realized by connecting the pin rod with the push rod; By setting the pressing mechanism, the Accelerate the exhaust during the solder ball casting process and reduce the occurrence of pores. At the same time, the briquetting block, the fixed mold and the movable mold together form a completed spherical surface to ensure the roundness of the solder ball; by setting the locking mechanism, the movable mold and the fixed mold are avoided. Retraction occurs after mold clamping, resulting in mold clamping failure; by setting a polishing mechanism under the fixed mold, the removal of burrs on the surface of solder balls is realized; a solder ball processing technology for wafer package chips includes: mold clamping and feeding, Mold opening, unloading and polishing.
Description
technical field [0001] The disclosure belongs to the field of solder ball production, and in particular relates to a solder ball manufacturing equipment for wafer packaged chips and a processing technology thereof. Background technique [0002] With the continuous development of science and technology, it is widely used in tinplate, flux, organic synthesis, chemical production, alloy manufacturing, and the assembly of multiple integrated circuits in the electronics industry. Solder balls play an important role in the packaging process of wafer-level chips. Its important role; most of the solder balls are casted, but in the prior art, the solder balls after casting will have defects near the pouring gate, resulting in unqualified solder balls; [0003] An automatic solder ball casting machine (patent number: 201811089224.9), which realizes the automatic production of solder balls by automatically controlling the inflow of tin liquid and automatically pouring and ejecting sold...
Claims
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IPC IPC(8): H01L21/67H01L21/48
CPCH01L21/4814H01L21/67011H01L21/67092H01L24/11H01L24/75H01L2224/1111H01L2224/11602H01L2224/753H01L2224/7555
Inventor 胡弘鹏杨秀缘
Owner 金易芯半导体科技(嘉兴)有限公司