Manufacturing method of circuit board solder mask layer
A manufacturing method and circuit board technology, which are applied in the application of non-metallic protective layers, secondary processing of printed circuits, etc., can solve the problem of increasing the deformation, warpage, expansion and contraction of circuit boards, limiting the manufacturing efficiency of solder resist insulating layers, and occupying space. , equipment, time and other issues, to achieve the effect of reducing production time, omitting static pre-curing equipment, and reducing poor deformation
Pending Publication Date: 2021-07-09
浙江欣旺达电子有限公司
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Problems solved by technology
Because each standing curing needs to be suspended in the air, it is the least efficient process in the production process of the solder mask insulating layer, which seriously limits the production efficiency of the solder mask insulating layer; and the high temperature environment will cause deformation and warping of the circuit board; on both sides of the circuit board When it is necessary to make solder resist ink graphics, the process flow needs to be repeated, and the process flow is carried out on each side. The second high temperature curing will cause more serious deformation of the circuit board and affect the quality of the circuit board.
In addition, since the ink pattern is not cured during pre-curing, it is susceptible to external interference and pollution; in order to ensure the correctness and integrity of the ink pattern, the semi-finished circuit board in the pre-curing stage needs to be suspended in the air, which seriously takes up space, equipment, time, and increases wiring. Board production cost, extended production cycle
Moreover, when solder resist ink patterns need to be made on both sides of the circuit board, the same circuit board needs to be cured at high temperature twice, which greatly increases the risk of deformation, warping, expansion and shrinkage of the circuit board, and affects the overall quality of the circuit board
Method used
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Embodiment 1
[0027] Embodiment 1, making circuit board solder mask
[0028] Flowchart such as figure 2 As shown, the specific steps are as follows:
[0029] S1. First, brush the solder resist ink on the first side of the circuit board, turn it over and place it on the corresponding carrier, and immediately brush the solder resist ink on the other side;
[0030] S2. Use the laser emitted by the exposure machine to irradiate both sides of the circuit board at the same time, perform laser pre-curing, and then use the exposure machine to simultaneously perform graphic exposure on both sides of the circuit board;
[0031] Among them, the wavelength of the laser is 125000nm, the time of laser pre-curing is 15min, and the time of graphic exposure is 10min;
[0032] S3, the circuit board is placed in an etching solution (sodium carbonate solution), and the solder resist patterns on both sides of the circuit board are etched simultaneously;
[0033] S4. Finally, put it into a high-temperature b...
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Abstract
The invention discloses a manufacturing method of a circuit board solder mask layer. The manufacturing method comprises the following steps: sequentially coating solder mask ink on solder mask areas on two surfaces of the circuit board; adopting a laser to simultaneously irradiate the solder mask ink on the two surfaces of the circuit board, and carrying out laser pre-curing; and sequentially carrying out pattern exposure, etching and high-temperature curing. According to the method, the circuit board solder mask insulation pattern can be rapidly manufactured, compared with an existing method, the two-time pre-curing time, the one-time pattern exposure time, the one-time pattern etching time, the one-time high-temperature curing time and the intermediate turnover time are saved, the production time is greatly shortened, original standing pre-curing equipment is omitted, and the production efficiency is improved; pattern exposure is simultaneously carried out on the two surfaces of the circuit board so that the alignment precision of the solder mask pattern on different surfaces can be improved; and the time of the circuit board in a high-temperature environment can be shortened by completely curing the solder mask patterns on the two sides of the circuit board at a time, abnormal deformation of the circuit board caused by a high temperature is reduced, and the overall quality yield of the circuit board is improved.
Description
technical field [0001] The invention relates to a method for manufacturing a solder resist layer of a circuit board, belonging to the technical field of circuit boards. Background technique [0002] In the production process of PCB, after the outer layer circuit is completed, a solder mask layer needs to be made on the surface of the production board to protect the circuit on the board surface. At present, the process of making solder mask in the industry is as follows: ① brush the whole piece of solder resist ink on the solder resist area; The incubator is cured at a high temperature for 20 to 30 minutes, and the process is as follows: figure 1 shown. Because each standing curing needs to be suspended in the air, it is the least efficient process in the production process of the solder mask insulating layer, which seriously limits the production efficiency of the solder mask insulating layer; and the high temperature environment will cause deformation and warping of the c...
Claims
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IPC IPC(8): H05K3/28
CPCH05K3/28
Inventor 伍可刘晓芬李武岐叶春霞梁咏欣
Owner 浙江欣旺达电子有限公司