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Component carrier and method for manufacturing same

A component bearing and component technology, applied in semiconductor/solid-state device manufacturing, printed circuit manufacturing, printed circuit components, etc., can solve problems such as easy warping

Active Publication Date: 2021-07-16
AT & S CHINA
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] The disadvantage of laminated part carriers is that they may be prone to warping

Method used

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  • Component carrier and method for manufacturing same
  • Component carrier and method for manufacturing same
  • Component carrier and method for manufacturing same

Examples

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Embodiment Construction

[0061] The illustrations in the figures are schematic. In different figures, similar or identical elements are provided with the same reference signs.

[0062] Exemplary embodiments will be described in more detail and some basic considerations based on the developed exemplary embodiments of the present application will be summarized before referring to the accompanying drawings.

[0063] According to an exemplary embodiment of the present application, a laminate type component carrier is provided with a low cure shrinkage dielectric for suppressing warping of the component carrier (eg printed circuit board, PCB). In particular, exemplary embodiments of the present application provide a concept of electronic component packaging based on lamination of low-shrinkage materials in a layer stack.

[0064] In particular, embedding technology has been confronted with the problem of warping behavior of manufactured component carriers. To address these types of issues, exemplary embo...

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Abstract

The present application provides a component carrier (100). The component carrier comprises a stack (102), and the stack comprises at least one electrically conductive layer structure (104) and / or at least one electrically insulating layer structure (106); and at least a portion of the at least one electrically insulating layer structure (106) comprises a material (108) having a cure shrinkage value of less than 2%, or at least a portion of the at least one electrically insulating layer structure consists of a material having a cure shrinkage value of less than 2%. In addition, the invention also provides a method for manufacturing the component carrier.

Description

technical field [0001] The present application relates to a component carrier. Furthermore, a method for producing a component carrier is disclosed. Background technique [0002] In the case of a component carrier equipped with one or more electronic components, the functions of the product are increasing, and the miniaturization of such components is increasing, and the number of components to be mounted on the component carrier (such as a printed circuit board) is increasing. In more and more contexts, more and more powerful array-like components or packages with multiple components with multiple contacts or connections with smaller spacings between the contacts are employed. During running operation, the removal of the heat generated by these components and the component carrier itself becomes an increasingly serious problem. At the same time, the component carrier should be mechanically robust and electrically reliable in order to be operable even under harsh condition...

Claims

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Application Information

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IPC IPC(8): H01L23/498H01L21/48H01L23/50
CPCH01L23/49816H01L23/49838H01L23/50H01L21/4853H01L21/6835H01L2221/68345H01L2221/68359H01L23/562H05K1/185H05K3/4697H05K1/0271H05K3/4626H01L23/485H05K1/09H05K1/0353H05K1/0298H01L23/3114H01L23/29H01L23/481H05K7/023H05K3/0058
Inventor 米凯尔·图奥米宁郑惜金
Owner AT & S CHINA
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