Solar cell and preparation method thereof
A solar cell and battery technology, applied in the field of solar cells, can solve the problems of photovoltaic cell cutting loss, conversion efficiency downshift, etc., and achieve the effect of reducing mismatch and improving efficiency
- Summary
- Abstract
- Description
- Claims
- Application Information
AI Technical Summary
Problems solved by technology
Method used
Examples
Embodiment 1
[0065] This embodiment provides a method for preparing a solar cell, which specifically includes the following steps:
[0066] (1) A single crystal N-type silicon wafer with a resistivity of 5Ω·cm and a thickness of 150 μm is used for texturing, rough polishing with KOH, texturing with KOH and texturing additives, and finally cleaning by RCA cleaning, and the surface is formed Pyramid suede to obtain a textured silicon wafer, the surface reflectivity of the textured silicon wafer of the silicon wafer is 12.5%;
[0067] (2) Plasma chemical vapor deposition is used to deposit a layer of intrinsic amorphous silicon layer on both sides of the textured silicon wafer, and the process gas is H 2 and SiH 4 , the volume flow ratio is 95:1, and the power density is 65mW / cm 2 , the thickness of the intrinsic amorphous silicon layer on one side is 10nm; a 20nm thick N-type doped amorphous silicon film layer is deposited on the surface of the intrinsic amorphous silicon layer on one side...
Embodiment 2
[0073] This embodiment provides a method for preparing a solar cell, which specifically includes the following steps:
[0074] (1) A single crystal N-type silicon wafer with a resistivity of 1 Ω cm and a thickness of 100 μm is used for texturing, rough polishing with KOH, texturing with KOH and texturing additives, and finally cleaning by RCA cleaning, and the surface is formed Pyramid suede to obtain a textured silicon wafer, the surface reflectance of the textured silicon wafer of the silicon wafer is 10.5%;
[0075] (2) Plasma chemical vapor deposition is used to deposit a layer of intrinsic amorphous silicon layer on both sides of the textured silicon wafer, and the process gas is H 2 and SiH 4 , the volume flow ratio is 95:1, and the power density is 65mW / cm 2 , the thickness of the intrinsic amorphous silicon layer on one side is 5nm; a 5nm thick N-type doped amorphous silicon film layer is deposited on the surface of the intrinsic amorphous silicon layer on one side b...
Embodiment 3
[0081] This embodiment provides a method for preparing a solar cell, which specifically includes the following steps:
[0082] (1) A single crystal N-type silicon wafer with a resistivity of 3Ω·cm and a thickness of 120μm is used for texturing, and KOH is used for rough polishing, and KOH and texturing additives are used for texturing, and finally cleaned by RCA cleaning, and the surface is formed Pyramid suede to obtain a textured silicon wafer, the surface reflectivity of the textured silicon wafer of the silicon wafer is 11.3%;
[0083] (2) Plasma chemical vapor deposition is used to deposit a layer of intrinsic amorphous silicon layer on both sides of the textured silicon wafer, and the process gas is H 2 and SiH 4 , the volume flow ratio is 95:1, and the power density is 65mW / cm 2 , the thickness of the intrinsic amorphous silicon layer on one side is 8nm; a 10nm thick N-type doped amorphous silicon film layer is deposited on the surface of the intrinsic amorphous silic...
PUM
| Property | Measurement | Unit |
|---|---|---|
| electrical resistivity | aaaaa | aaaaa |
| thickness | aaaaa | aaaaa |
| thickness | aaaaa | aaaaa |
Abstract
Description
Claims
Application Information
Login to View More