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High frequency transmission device and high frequency signal transmission method

A high-frequency transmission and high-frequency signal technology, applied in the direction of coupling devices, transmission systems, two-component connection devices, etc., can solve the problems that high-frequency signals are easily affected by transmission loss, do not flow to metal, and AC resistance value increases

Active Publication Date: 2021-07-23
HOSIDEN CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0002] Generally, when an alternating current passes through a metal, the skin effect causes the alternating current to flow near the surface of the metal, but hardly to the central part of the metal, resulting in an increase in the alternating current resistance (AC) value of the metal
This is because a counter electromotive force is generated in the central part of the metal, making it difficult for current to flow
Since high-frequency signals work in the same way as alternating current, when a high-frequency signal passes through a transmission line made of metal, the AC resistance value of the transmission line increases, making the high-frequency signal more susceptible to transmission loss (attenuation)

Method used

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  • High frequency transmission device and high frequency signal transmission method
  • High frequency transmission device and high frequency signal transmission method
  • High frequency transmission device and high frequency signal transmission method

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no. 1 approach

[0052] The following is the reference Figure 1A and Figure 1B Description of the high-frequency transmission device D1 according to a plurality of embodiments including the first embodiment according to the present invention. The high frequency transmission device D1 is a circuit board for high frequency transmission. The high-frequency transmission device D1 can also be referred to as a transmission board D1. Figure 1A and Figure 1B The transmission board D1 of the first embodiment is shown.

[0053] The transmission board D1 includes a dielectric 100 . Figure 1B The Z-Z' direction is shown as the thickness direction of the dielectric 100, and the Z-Z' direction includes the Z direction and the opposite Z' direction. The dielectric 100 has a first face 101 on the Z direction side and a second face 102 on the Z′ direction side.

[0054] The transmission board D1 also includes a transmission line 200 suitable for transmitting high-frequency signals. The transmission l...

no. 2 approach

[0089] The following is the reference Figure 2A and Figure 2B Description of the high-frequency transmission device D2 according to a plurality of embodiments including the second embodiment according to the present invention. The high frequency transmission device D2 is a circuit board for high frequency transmission. The high-frequency transmission device D2 can also be referred to as a transmission board D2. Figure 2A and Figure 2B A transmission board D2 of a second embodiment is shown. Transmission board D2 is similar in construction to transmission board D1, but differs in that, in addition to signal conductor S' and ground conductor G (first ground conductor), transmission line 200' also includes a ground conductor G' (second ground conductor) ), the signal conductor S' is disposed inside the dielectric 100'. The difference will be described in detail, and the overlapping description with the transfer board D1 will be omitted. Figure 2B The Z-Z' direction is ...

no. 3 approach

[0125] The following is the reference Figure 3A and Figure 3B Description of the high-frequency transmission device D3 according to a plurality of embodiments including the third embodiment according to the present invention. The high frequency transmission device D3 is a circuit board for high frequency transmission. The high-frequency transmission device D3 can also be referred to as a transmission board D3. Figure 3A and Figure 3B A transmission board D3 of a third embodiment is shown. The transmission board D3 is similar in configuration to the transmission board D1, but differs in that the transmission line 200" includes a signal conductor S" and a pair of ground conductors G". The difference will be described in detail, and the description repeated with the transmission board D1 will be omitted. In addition to the Z-Z' direction, Figure 3B It is also indicated that the X-X' direction is the lateral direction of the signal conductor S".

[0126]The signal condu...

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Abstract

To reduce a transmission loss in a high frequency signal by using a polycrystalline substance having a property in which an AC resistance value is sharply lowered when the high frequency signal is transmitted. A high frequency transmission device D1 is provided with a dielectric 100 and a transmission line 200 through which the high frequency signal is transmittable. At least a portion of the transmission line 200 is disposed on the dielectric 100 or in the dielectric 100. At least a portion of the transmission line 200 is composed of a polycrystalline substance composed of conductor fine particles. The polycrystalline substance has a property in which an AC resistance value is sharply lowered when the frequency of the high frequency signal transmitted through the transmission line 200 is in one or a plurality of specific frequency bands.

Description

technical field [0001] The invention relates to high-frequency transmission equipment and a high-frequency signal transmission method. Background technique [0002] Generally, when an alternating current passes through a metal, the skin effect causes the alternating current to flow near the metal surface but hardly to the central part of the metal, resulting in an increase in the alternating current resistance (AC) value of the metal. This is because a counter electromotive force is generated in the central part of the metal, making it difficult for current to flow. Since high-frequency signals work in the same way as alternating current, when a high-frequency signal passes through a transmission line made of metal, the AC resistance value of the transmission line increases, making the high-frequency signal more susceptible to transmission loss (attenuation). [0003] Non-Patent Document 1 identified below describes polycrystals composed of iron nanoparticles or metal-grade...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01P3/08H01B7/30H01B11/00H01P3/00H01P3/02H01P3/06
CPCH01P3/081H01P3/085H01P3/003H01P3/026H01P11/003H01R24/50H01R2103/00H01P11/005H01P3/06H01B11/00H01B7/30H01P3/08H04B1/02H04B3/52
Inventor 近藤快人笹田浩介
Owner HOSIDEN CORP