Method for reducing multi-wire cutting breakage rate and application

Abstract

The invention discloses a method for reducing the multi-wire cutting breakage rate. The method comprises the following steps of: according to the current steel wire cutting tension, determining the wire twist of a wire wheel, and adjusting the wire wheel with larger wire twist, firstly enabling a diamond wire entering a guide wheel to completely fall at the center of an included angle of a pulley 5 by utilizing the diamond wire entering the guide wheel, and determining an angle position of the pulley 5 accordingly; secondly, using a laser collimator for adjusting a pulley 4 with the pulley 5 as the reference, and enabling the tangent line of the upper plane of the pulley 5 to coincide with the tangent line of the upper plane of the pulley 4; drawing a pulley 3 and the pulley 4 close, measuring whether the surfaces of the two pulleys are located on the same plane by using a flat triangular ruler, and adjusting a position and an inclination degree of the pulley 3 to enable the tangent line of the upper plane of the pulley 3 and the tangent line of the lower plane of the pulley 4 to be located on one same straight line; if the wire from the wire wheel 1 is just located at the center of the included angle of the side surface of the pulley 1, determining that the adjustment is successful; and if deflection exists, repeating the steps for continuous adjustment. According to the method for reducing the multi-wire cutting breakage rate provided by the invention, fatigue damage of the diamond wire in the cutting process can be reduced, and the breaking force is enhanced.

Description

technical field [0001] The invention belongs to the field of multi-wire cutting of single crystal silicon wafers, and in particular relates to a method and application for reducing the wire breakage rate of multi-wire cutting. Background technique [0002] In the cutting of monocrystalline silicon wafers for photovoltaic silicon wafers, the diamond wire is closely related to the cutting cost and cutting efficiency: the diameter of the steel wire is inversely proportional to the number of silicon rods per unit length, that is, the smaller the diameter of the steel wire, the higher the unit length. The more pieces of length silicon rods are produced, the lower the cost; therefore, the general application of thinner wires is a trend, but in actual production, the breaking force that diamond wires can withstand after being thinner also decreases significantly, which is easy to cause operational problems. The wire breaks during neutralization and cutting, resulting in a decrease ...

AI Technical Summary

Problems solved by technology

However, although this solution reduces the disconnection rate in the actual use process, the reason for the actual production disconnection is a combination of various factors. The existing technical solution is aimed at the "law" aspect of the "man-machine-material-law loop". Make adjustments, not involved in other aspects

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