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Adhesive composition for optical irradiation peeling, laminate body, and laminate body production method and peeling method

An adhesive and light irradiation technology, applied in bonding methods, chemical instruments and methods, semiconductor/solid-state device manufacturing, etc., can solve problems such as large wafer damage, and achieve the effects of excellent dispersibility and good light absorption capacity

Pending Publication Date: 2021-08-06
NISSAN CHEM IND LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0006] However, the temporary adhesive used in this bonding and separation process generates heat and gas due to irradiation of laser light, which greatly damages the wafer.

Method used

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  • Adhesive composition for optical irradiation peeling, laminate body, and laminate body production method and peeling method
  • Adhesive composition for optical irradiation peeling, laminate body, and laminate body production method and peeling method
  • Adhesive composition for optical irradiation peeling, laminate body, and laminate body production method and peeling method

Examples

Experimental program
Comparison scheme
Effect test

Embodiment

[0169] (1) Mixer: Rotation and revolution mixer ARE-500 made by THINKY Co., Ltd.

[0170] (2) Viscosity measurement: Toki Sangyo Co., Ltd. rotational viscometer TVE-22H

[0171] (3) Measurement of transmittance: UV2550 ultraviolet-visible spectrophotometer manufactured by Shimadzu Corporation

[0172] (4) Vacuum bonding device: SUSS MicroTec Co., Ltd., manual bonding machine (Manual Bonder)

[0173] (5) 308nm laser irradiation device: manufactured by SUSS MicroTec Co., Ltd., 308nm laser irradiation device

[0174] (6) Infrared radiation thermometer: manufactured by TESTO Co., Ltd., infrared radiation thermometer 835-H1

[0175] (7) 532nm laser irradiation device: LT-2137 manufactured by Lotus-TII

[0176] [1] Preparation of composition

preparation example 1

[0178] 95 g of vinyl-containing MQ resin (manufactured by Wacker Chemie) as polysiloxane (a1), 93.4 g of p-menthane (manufactured by Nippon Terpene Chemical Co., Ltd.) as a solvent, and 0.41 g of 1,1-diphenyl-2-propyn-1-ol (manufactured by Tokyo Chemical Industry Co., Ltd.) of the polymerization inhibitor (A3) was stirred with a stirrer for 5 minutes.

[0179] To the obtained mixture was added Si—H group-containing linear polydimethylsiloxane (manufactured by Wacker Chemie) having a viscosity of 100 mPa·s as polysiloxane (a2), polysiloxane (a2) (a1) 29.5 g of vinyl-group-containing linear polydimethylsiloxane (manufactured by Wacker Chemie) having a viscosity of 200 mPa·s, and viscosity of polydimethylsiloxane as component (B) 1,000,000 mm 2 / s polyorganosiloxane (manufactured by Wacker Chemie, trade name AK1000000), and 0.41 g of 1-ethynyl-1-cyclohexanol (manufactured by Wacker Chemie) as (A3), were stirred for 5 minutes with a stirrer.

[0180] 14.9 g of the following mixtu...

preparation example 2

[0183] 95 g of vinyl-containing MQ resin (manufactured by Wacker Chemie) as polysiloxane (a1), 93.4 g of p-menthane (manufactured by Nippon Terpene Chemical Co., Ltd.) as a solvent, and 0.41 g of 1,1-diphenyl-2-propyn-1-ol (manufactured by Tokyo Chemical Industry Co., Ltd.) of the polymerization inhibitor (A3) was stirred with a stirrer for 5 minutes.

[0184] To the obtained mixture was added Si—H group-containing linear polydimethylsiloxane (manufactured by Wacker Chemie) having a viscosity of 100 mPa·s as polysiloxane (a2), polysiloxane (a2) (a1) 23.6 g of vinyl-group-containing linear polydimethylsiloxane (manufactured by Wacker Chemie) having a viscosity of 200 mPa·s, and viscosity of polydimethylsiloxane as component (B) 1,000,000 mm 2 / s polyorganosiloxane (manufactured by Wacker Chemie, trade name AK1000000), and 0.41 g of 1-ethynyl-1-cyclohexanol (manufactured by Wacker Chemie) as (A3), were stirred for 5 minutes with a stirrer.

[0185] To the obtained mixture was a...

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Abstract

The adhesive composition for optical irradiation peeling, which makes possible peeling with optical irradiation, contains an adhesive component and carbon black, and the adhesive component contains a component (A) which cures with a hydrosilylation reaction.

Description

technical field [0001] The present invention relates to an adhesive composition for peeling by light irradiation, a laminate, and a method for producing and peeling the laminate. Background technique [0002] Conventionally, semiconductor wafers integrated in a two-dimensional planar direction have required semiconductor integration technology in which planes are further integrated (laminated) in a three-dimensional direction for the purpose of further integration. This three-dimensional lamination is a technique for performing multilayer integration while wiring through through silicon vias (TSV: through silicon via). In the case of multilayer integration, the wafers to be integrated are polished to thin the opposite side (ie, the back side) of the circuit surface to be formed, and the thinned semiconductor wafers are stacked. [0003] The semiconductor wafer before thinning (here also simply referred to as wafer) is bonded to the carrier for grinding with a grinding devic...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B32B27/00C09J11/04C09J183/04C09J183/05C09J183/07C09J201/00H01L21/02H01L21/304C09J7/30C09J7/40B32B7/12
CPCC09J183/04C08G77/80C08G77/12C08G77/20C08L2205/025H01L21/6835H01L2221/68318H01L2221/68381H01L2221/68327C09J5/00C09J2301/502C09J2301/416C09J2483/00C09J2203/326C08K3/04C08L83/00C08K5/56C08K5/0025C09J11/04C09J7/30C09J7/40C09J201/00B32B27/00B32B7/12H01L21/20H01L21/304B32B37/1284B32B43/006B32B2255/26B32B2310/0843C08G77/50C08G77/70C09J183/14H01L24/29H01L24/32H01L24/83H01L24/98H01L2221/68386H01L2224/2919H01L2224/32225H01L2224/83203H01L2224/8385H01L2224/98
Inventor 荻野浩司新城彻也柄泽凉奥野贵久
Owner NISSAN CHEM IND LTD