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A kind of in-situ force thermoelectric multi-field coupling test chip and preparation method thereof

A potential force and thermoelectric technology, applied in the field of force thermoelectric multi-field coupling test chip, can solve the problems of inability to measure the electrical characteristics of samples, large errors in mechanical performance testing, and inability to perform multi-physics field coupling tests, etc.

Active Publication Date: 2022-03-01
SOUTHEAST UNIV
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  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

However, there are still few in situ force thermoelectric multi-physics field coupling testing techniques that can be used under transmission electron microscopy, and the reported techniques are generally limited to single-field or double-field coupling loading.
[0004] The existing commercial sample rods on the market include Hysitron’s PI-type nanoindentation instrument, which can realize the uniaxial tensile and mechanical properties of nanomaterials, but the experimental instrument is expensive, and a specific experimental environment must be customized, and Inability to achieve multiphysics integration
[0005] A force-thermal coupling test chip based on thermal actuators and heating resistance wires developed by the research group of Professor Han Xiaodong of Beijing University of Technology can realize in-situ mechanical uniaxial stretching of nanomaterials at high temperatures, but the chip is due to The overall rigidity of the structure is large and the electrical test design is lacking, which affects the accurate measurement of the mechanical properties of nanomaterials during the stretching process, resulting in large errors in the mechanical performance tests such as Young's modulus of micro-nano materials, and it is impossible to measure the mechanical properties of the samples. electrical properties
[0006] The in-situ characterization device for dynamic mechanical loading of nanomaterials developed by the research group of Wang Yuelin, Shanghai Institute of Microsystem and Information Technology, Chinese Academy of Sciences, can realize static and dynamic stress loading tests of nanomaterials, but the chip preparation process is complex and Its electrical testing technology is a two-probe test, which cannot eliminate the influence of contact resistance between the test material and the sample stage, which seriously affects the accurate measurement of the electrical characteristics of nanomaterials during the stretching process, and cannot measure the force of the material under different temperature fields. - Electric coupling characteristic test
[0007] Professor Horacio D. Espinosa of Northwestern University in the United States has developed a dual-tilt transmission electron microscope MEMS sample rod, which can realize static mechanical stretching and measurement, and can obtain high-resolution imaging of materials through biaxial tilting, and is equipped with capacitive sensors for automatic detection The material is stressed, but the sample holder design is complex and multiphysics coupling testing is not possible

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  • A kind of in-situ force thermoelectric multi-field coupling test chip and preparation method thereof
  • A kind of in-situ force thermoelectric multi-field coupling test chip and preparation method thereof
  • A kind of in-situ force thermoelectric multi-field coupling test chip and preparation method thereof

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Embodiment Construction

[0038] The technical solution of the present invention will be described in detail below in conjunction with the accompanying drawings.

[0039] like figure 1 As shown, an in-situ force thermoelectric multi-field coupling test chip of the present invention includes a first electrostatic actuator 31, a second electrostatic actuator 32, a first heating beam 33 connected to the first electrostatic actuator 31, and a second electrostatic actuator 31. The second heating beam 34 connected to the two electrostatic actuators 32; the first electrostatic actuator 31 and the second electrostatic actuator 32 have the same structure, both of which are electrostatic comb capacitor structures.

[0040] The first electrostatic actuator 31, the second electrostatic actuator 32, the first heating beam 33, and the second heating beam 34 are all symmetrical about the same central axis; the first heating beam 33 and the second heating beam 34 are symmetrical to each other, and are perpendicular to...

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Abstract

The invention discloses an in-situ force thermoelectric multi-field coupling test chip and a preparation method thereof, comprising a first electrostatic actuator, a second electrostatic actuator, a first heating beam connected to the first electrostatic actuator, and a second electrostatic actuator. The second heating beam connected to the actuator; the first electrostatic actuator is provided with a first sample stage, and the second electrostatic actuator is provided with a second sample stage; the first heating beam is perpendicular to the central axis, and is the same as the first The sample stage is connected to heat the first sample stage; the chip of the present invention integrates three physical field coupling loading functions of force, heat and electricity, and realizes the following functions: the accuracy of the electrical parameters, mechanical parameters and temperature fields of the samples to be tested Static single-parameter or multi-parameter coupling test; coupling test between the creep and fatigue characteristics analysis of the sample to be tested under plane tension and the temperature field; the relationship between the fatigue characteristics and the electrical parameters and mechanical parameters of the sample to be tested under different temperature fields Analysis of the coupling relationship law, reliability failure analysis of the sample to be tested, etc.

Description

technical field [0001] The invention relates to an in-situ test chip, in particular to a force thermoelectric multi-field coupling test chip based on a sample to be tested realized in a TEM / SEM electron microscope. Background technique [0002] In the past few decades, people have aroused great interest in the mechanical properties of low-dimensional materials. Low-dimensional materials such as nanowires, carbon nanotubes and graphene are important basic research directions, because they are different from bulk materials. The exceptional properties of bulk materials and the potential to possess unique and customizable physical properties enable a variety of nanotechnology applications including energy harvesting and storage, nanoelectromechanical systems (NEMS), flexible electronics, and stretchable electronics. In addition, when the characteristic size of the material is reduced to the micro-nano scale, its mechanical properties are significantly different from those of mac...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): G01N3/02G01N3/18G01N27/04G01N23/2251G01N23/04G01N23/20
CPCG01N3/02G01N3/18G01N27/041G01N23/2251G01N23/04G01N23/20G01N2203/0017G01N2203/0071G01N2203/0073G01N2203/0075G01N2203/0222
Inventor 聂萌黄语恒尹奎波陈姝宁
Owner SOUTHEAST UNIV