Routing flexible circuit board for packaging image sensor and preparation process of routing flexible circuit board
A technology of image sensor and flexible circuit board, which is applied in the fields of printed circuit manufacturing, circuit, printed circuit, etc., can solve the problem that the top of the flexible circuit board cannot be wired, etc., to improve the utilization efficiency of the focal plane, reduce the surface area, and increase the thickness Effect
Pending Publication Date: 2021-08-10
CHANGCHUN INST OF OPTICS FINE MECHANICS & PHYSICS CHINESE ACAD OF SCI
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[0004] The present invention solves the technical problem that the top of the flexible circuit board in the prior art cannot be wired, and provides a flexible circuit board capable of being wired for image sensor packaging and its preparation process
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[0034] The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only some, not all, embodiments of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the protection scope of the present invention.
[0035] see Figure 1-5 , the flexible printed circuit board that can be bonded for the image sensor packaging, including the image sensor 1 and the photosensitive surface 2 of the image sensor, the photosensitive surface 2 of the image sensor is located on the image sensor 1, and also includes the flexible circuit board 3, which is arranged on the side of the image sensor 1 and Electrically connect with the photosensitive surface 2 of the image sensor through ...
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The invention discloses a routing flexible circuit board for packaging an image sensor and a preparation process of the routing flexible circuit board, relates to the field of image sensor packaging, and solves the problem that the top end of a flexible circuit board in the prior art cannot be routed. The image sensor is technically characterized by comprising an image sensor and an image sensor light-sensitive surface, the image sensor light-sensitive surface is located on the image sensor, and the image sensor further comprises a flexible circuit board which is arranged on the side face of the image sensor and electrically connected with the image sensor light-sensitive surface through routing; the flexible circuit board comprises a flexible circuit board substrate and a wire bonding carrier arranged on the flexible circuit board substrate, the wire bonding carrier is electrically connected with the flexible circuit board substrate, and the flexible circuit board substrate is electrically connected with the light-sensitive surface of the image sensor through wire bonding through the wire bonding carrier. While the line outgoing requirement of the flexible circuit board on the side surface of the image sensor is met, the space for leading out signals in the focal plane is reduced, and the space of the focal plane is effectively utilized.
Description
technical field [0001] The invention relates to the technical field of image sensor packaging, in particular to a wire-bondable flexible circuit board for image sensor packaging and a preparation process thereof. Background technique [0002] Flexible circuit board is a highly reliable and bendable printed circuit board made of polyimide or polyester film, with high wiring density, light weight, thin thickness and good bending performance, etc. advantage. [0003] With the development of deep space exploration technology in recent years, the requirements for the pixels of the focal plane of the telescope are getting higher and higher. A single image sensor can no longer meet the needs of super large pixels. It is usually necessary to use multiple image sensors at the focal plane for splicing, while the traditional The traditional method of designing the image sensor chip and the processing circuit on the same plane cannot meet the space requirements. Therefore, it is neces...
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IPC IPC(8): H01L27/146H05K1/11H05K3/40
CPCH01L27/14618H05K1/111H05K1/118H05K3/4007H05K3/403
Inventor 郭亮韩康贾卓杭
Owner CHANGCHUN INST OF OPTICS FINE MECHANICS & PHYSICS CHINESE ACAD OF SCI