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A large-scale preparation method for microstructures that enhance heat transfer

A technology to enhance heat transfer and microstructure, applied in electrochemical processing equipment, manufacturing tools, metal processing equipment, etc., can solve the problems of long preparation time, cumbersome steps, time-consuming and laborious, etc., and achieve good surface quality and thickness control Precise, wide-ranging effects

Active Publication Date: 2022-04-12
NANJING UNIV OF AERONAUTICS & ASTRONAUTICS
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

At present, the preparation methods of surface texture structure include embossing technology, mechanical vibration processing technology, abrasive jet processing technology, laser processing technology, EDM technology and electrolytic machining, but the surface texture processed by imprinting technology is usually affected by the workpiece material. Due to the limitations of hardness and other characteristics, it is difficult to realize on metal workpieces; mechanical vibration processing technology is a method in which the tool has a certain regular reciprocating vibration under the action of servo drive, and the workpiece is processed while matching the tool movement to process the surface texture on the surface of the workpiece. The method often has mechanical residual stress in the cutting process, which affects the quality of surface texture processing, and this method needs to be processed one by one, which is not suitable for large-scale preparation; abrasive jet processing technology, laser processing technology, and electric discharge processing technology can all be used Micropit structures are prepared on the metal surface, but they can only be prepared one by one, which can be used for laboratory preparation, but large-scale preparation is time-consuming and labor-intensive, and the efficiency is low
In summary, the above methods all have the defects of long preparation time, cumbersome steps and low efficiency, and cannot be mass-produced. At the same time, the prepared structure is also a simple microgroove and micropit structure. The preparation method of heat transfer microstructures for large-scale production is of great significance

Method used

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  • A large-scale preparation method for microstructures that enhance heat transfer
  • A large-scale preparation method for microstructures that enhance heat transfer
  • A large-scale preparation method for microstructures that enhance heat transfer

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0048] Step 1): electroforming a nickel metal layer A2 with a thickness of 25 μm on the upper surface of the copper substrate 1, and then polishing the nickel metal layer A2 until the surface roughness of the nickel metal layer A is Ra<0.2;

[0049] Step 2): Coating a layer of PDMS template 3 on the surface of the polished nickel metal layer A, opening a through hole on the surface of the template to obtain a workpiece, the thickness of the PDMS template 3 is 250 μm, the diameter of the micro-through hole is 100 μm, and the number of micro-through holes is 30* 30;

[0050] Step 3): The workpiece is subjected to electrolytic processing, the voltage is 12V, the duty cycle is 20%, the electrolyte is 100g / L sodium nitrate solution, the pressure is 0.1MPa, and the electrolysis is 2min;

[0051] Step 4): Remove the PDMS template 3, then drop acidic copper etching solution 4 at the electrolytic processing position of the workpiece, and etch at 30°C for 4 minutes; operation;

[0052...

Embodiment 2

[0056] Step 1): electroforming a layer of nickel metal layer A2 with a thickness of 25 μm on the upper surface of the iron substrate 1, and then polishing the nickel metal layer A2 until the surface roughness of the nickel metal layer A2 is Ra<0.2;

[0057] Step 2): coating a layer of SU-8 dry film photoresist mold 3 with a through hole on the surface of the polished nickel metal layer A2 to obtain a workpiece, the thickness of the SU-8 dry film photoresist mold 3 is 25 μm, micro The diameter of the through hole is 100μm, and the number of micro through holes is 30*30;

[0058] Step 3): The workpiece is subjected to electrolytic processing, the voltage is 12V, the duty cycle is 20%, the electrolyte is 100g / L sodium nitrate solution, the pressure is 0.1MPa, and the electrolysis is 2min;

[0059] Step 4): Add acidic copper chloride etching solution 4 dropwise at the workpiece electrolytic processing position, and etch at 30°C for 4 minutes; during the etching process, perform me...

Embodiment 3

[0063] Same as embodiment 1, the difference is that the substrate is copper, and the metal A is gold.

[0064] In this embodiment, 900 microgrooves of 30*30 can be processed at the same time, and the microgrooves have a complete structure, no defects such as burrs, burrs, and air bubbles, and the microgrooves are uniform in size.

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Abstract

The invention discloses a large-scale preparation method of microstructures for enhanced heat transfer, which belongs to the technical field of electrical processing. It specifically includes the following steps: Step 1: Electroform a layer of metal A on the surface of the substrate, and then polish the metal A; Step 2: Coat a layer of template on the surface of the polished metal A, and open a through hole on the surface of the template , to obtain the workpiece; step 3: electrolytically machining the workpiece; step 4: dripping copper etching solution at the electrolytic machining position of the workpiece for etching; step 5: cleaning the workpiece, and obtaining the enhanced heat transfer microstructure. The method has the characteristics of safety, high efficiency and is suitable for large-scale mass production, and the material of the substrate can be changed according to actual requirements to adapt to various production requirements.

Description

technical field [0001] The invention belongs to the technical field of electrical processing, and in particular relates to a large-scale preparation method of microstructures for enhanced heat transfer. Background technique [0002] Omniphobic microstructure (full hydrophobic microstructure) is a blind hole-like structure with a small opening and a large interior. Studies have shown that the super-hydrophobic surface based on this microstructure has a series of enhanced heat transfer, self-cleaning, and pollution prevention. Excellent performance, belongs to a kind of surface texture. Surface texture technology refers to the technology that the surface of the workpiece has array patterns such as pits, protrusions, grooves and scales of a certain shape, size and distribution. Surface texture with micro / nanoscale plays a vital role in energy exchange, signal transmission, bionics, friction and wear, etc., and shows broad development prospects in many fields. At present, the ...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B23H3/00C25D1/00C25F3/14
CPCB23H3/00C25D1/00C25F3/14
Inventor 房晓龙韩鸿恩杨晓龙
Owner NANJING UNIV OF AERONAUTICS & ASTRONAUTICS