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Nondestructive repair device and method for 3D laminated packaging device

A technology of stacked packaging and devices, applied in auxiliary devices, metal processing equipment, welding equipment, etc., can solve problems such as low operation efficiency, achieve high de-soldering efficiency, improve safety and reliability, and strong practicability.

Pending Publication Date: 2021-08-31
XIAN MICROELECTRONICS TECH INST
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] In order to overcome the disadvantages of the above-mentioned prior art, such as the low operating efficiency of the traditional rework process and the device scrap rate above 98%, the purpose of the present invention is to provide a non-destructive rework device and method for 3D stacked package devices

Method used

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  • Nondestructive repair device and method for 3D laminated packaging device

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0032] see figure 1 , a non-destructive rework device for 3D stacked packaging devices, comprising a soldering iron tip 1, a soaking block 2, a lifting rope 4 and a printed board 5;

[0033] The 3D stacked packaging device is arranged horizontally, and there are two soldering iron tips 1, and the two soldering iron tips 1 are respectively installed on the two ends of the leads on the 3D stacked packaging device; there are two soaking blocks 2, and two soaking blocks 2 They are respectively installed on both sides of the 3D stacked packaging device; the lifting rope 4 penetrates into the 3D stacked packaging device, and the printed board 5 is installed on the bottom of the 3D stacked packaging device.

Embodiment 2

[0035] Except for the following content, all the other contents are the same as in Example 1.

[0036] The heat soaking block 2 is rectangular in shape, the width of the heat soaking block 2 is 2 mm, and the length is the same as that of the 3D stack package device. The soldering iron tip 1 is a knife-shaped soldering iron tip; the lifting rope 4 is a cotton lifting rope; the diameter of the lifting rope 4 is Φ0.3~Φ0.5, and the pulling length is 60mm~80mm.

Embodiment 3

[0038] A non-destructive repair method for a 3D stacked packaging device, comprising the steps of:

[0039] Step 1) Place the 3D stacked package device to be desoldered on the printed board 5, make a lifting rope 4 according to the 3D stacked package device, and pass the prepared lifting rope 4 into the 3D stacked package device to be desoldered the bottom of the device;

[0040] Step 2) Spread a soaking block 2 on both sides of the 3D stacked package device to be desoldered, and install soldering iron tips 1 on both ends of the leads on the 3D stacked package device;

[0041] Step 3) Open the soaking block 2 to start working, then preheat the printed part on the back of the 3D stacked package device to be desoldered, preheat the two ends of the 3D stacked package device to be desoldered without leads, and open Soldering iron head 1 works, and heats both ends of the leads on the 3D stacked package device to be desoldered at the same time, until the solder on the leads at both...

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Abstract

The invention discloses a nondestructive repair device and method for a 3D stacked packaging device, and belongs to the field of component repair. A lifting rope is manufactured according to the size of the device, and the lifting rope penetrates into the bottom of the device so that the device can be extracted and separated during desoldering in the later period; and soaking blocks are flatly laid on lead planes on the two sides of the device, printed piece parts on the back surface of the to-be-desoldered device are preheated by using a heating table, the two non-lead ends of the device are preheated by adopting temperature control electric hot blowing, the two lead ends of the device are simultaneously heated by using two knife-shaped soldering bits, and after soldering tin on the leads at the two ends is molten, the cotton lifting rope is lifted to lightly take down the 3D laminated packaging device. According to the nondestructive 3D laminated packaging device dismounting process method, the external structure and the internal structure of the device are not damaged under the low-temperature condition, the device repaired through the method can be repeatedly used, the internal structure of the device is not damaged, the rejection rate of the 3D laminated packaging device is reduced, and the production and repair cost of products is saved.

Description

technical field [0001] The invention belongs to the field of component repair, and relates to a non-destructive repair device and method for 3D laminated packaging devices. Background technique [0002] 3D stacked packaging devices are the core key devices for aerospace products to achieve high density, miniaturization, and large-capacity storage, and are widely used in various stand-alone machines with storage functions. However, a large number of aerospace electronic products are repaired and replaced during the test and use process. In this process, it is usually necessary to ensure the integrity of the off-machine components and perform failure analysis. Due to the particularity of the shell material of this type of packaging device that is not resistant to high temperature, and is more sensitive to soldering and rework temperature conditions, the operation efficiency is low according to the traditional rework process, and the device scrap rate is above 98%. Contents o...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B23K3/02B23K3/08
CPCB23K3/02B23K3/08
Inventor 栗凡屈云鹏党荣辉
Owner XIAN MICROELECTRONICS TECH INST