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A kind of epoxy modified chlorinated polypropylene adhesive

A chlorinated polypropylene, epoxy modification technology, applied in the direction of adhesive types, adhesives, epoxy resin adhesives, etc., can solve the problem of strict reaction conditions, complex preparation methods, insufficient water resistance and electrical insulation of adhesives Insufficient and other problems, to achieve the effect of reducing water absorption, increasing the tensile strength of the body, and increasing the volume resistivity

Active Publication Date: 2022-02-22
NANJING UNIV +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] However, the above-mentioned modified chlorinated polypropylene adhesive, due to the epoxy curing agent or crosslinking agent component mixed in the chlorinated polypropylene solution, between the epoxy curing agent, crosslinking agent components, or between them and the modified There is a reaction between chlorinated polypropylenes, which will shorten the working time of the adhesive. In addition, more polar groups such as various crystalline acids, acrylic acid or amine curing agents are introduced or directly used through grafting reactions. Not only the preparation method is complicated and the reaction conditions are strict, but also the water resistance and electrical insulation of the adhesive are not sufficient, and it cannot meet the water resistance, electrical insulation, and bonding requirements of the adhesive for high-voltage insulation equipment such as insulators at the same time.

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0016] An epoxy-modified chlorinated polypropylene adhesive consists of 100 parts of chlorinated polypropylene with a chlorine content of 27%, 30 parts of epoxy glue prepolymer solution and 1000 parts of analytically pure toluene in parts by weight. Described epoxy glue prepolymer solution, by weight, by 15 parts of hydrogenated bisphenol A epoxy resins, 4.5 parts of N-β-(aminoethyl)-γ-aminopropyl methyl dimethoxysilane And 10.5 parts of pentanone solvent prepared.

[0017] The preparation step of described epoxy glue prepolymer solution: add N-beta-(aminoethyl)-gamma-aminopropylmethyl dimethoxysilane in hydrogenated bisphenol A epoxy resin, rotational viscometer The initial viscosity that records reactant is 190 centipoise (25 ℃), room temperature stirs reaction, monitors reactant viscosity, when reactant viscosity reaches 1000 centipoise (25 ℃), adds pentanone solvent, makes epoxy glue pre- polymer solution.

Embodiment 2

[0019] A kind of epoxy-modified chlorinated polypropylene adhesive, by weight, be 24% chlorinated polypropylene by 100 parts of chlorine content, 60 parts of epoxy glue prepolymer solution and 600 parts of analytical pure toluene and 600 parts Analysis of the composition of pure pentanone. Described epoxy glue prepolymer solution, by weight, by 20 parts of hydrogenated bisphenol A epoxy resins, 5 parts of γ-aminopropyl methyldiethoxysilane, 5 parts of N-β-(amino ethyl base)-γ-aminopropylmethyldimethoxysilane and 30 parts of pentanone solvent.

[0020] The preparation steps of the epoxy glue prepolymer solution: add γ-aminopropylmethyldimethoxysilane to the hydrogenated bisphenol A epoxy resin, and the initial viscosity of the reactant measured by the rotational viscometer is 100 centimeters Poise (25°C), react with stirring at room temperature, monitor the viscosity of the reactant, when the viscosity of the reactant reaches 700 centipoise (25°C), add pentanone solvent to pre...

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Abstract

An epoxy-modified chlorinated polypropylene adhesive, the adhesive consists of 100 parts of chlorinated polypropylene with a chlorine content of 15-30%, 10-80 parts of epoxy glue prepolymer solution and 300-2000 parts Composed of organic solvents, the epoxy glue prepolymer solution is prepared from alicyclic epoxy resin, amino-containing siloxane and pentanone solvent. After the epoxy adhesive prepolymer is cured, it forms an interpenetrating network structure with the chlorinated polypropylene resin. Epoxy-modified chlorinated polypropylene adhesive has both the adhesiveness of epoxy glue and chlorinated polypropylene, and its water resistance and electrical insulation are synergistically improved, and it is used for bonding in high-voltage insulators such as insulators agent.

Description

technical field [0001] The invention belongs to the technical field of adhesives, in particular to an epoxy-modified chlorinated polypropylene adhesive. Background technique [0002] Chlorinated polypropylene is a thermoplastic resin made of polypropylene resin modified by chlorination. It has excellent adhesion to polyolefin materials and is often used as adhesives, coatings, and inks. There are disadvantages such as weak polarity, low cohesion, poor compatibility with polar resins, and poor adhesion, which limit its performance and application range, especially in the application field of high-voltage insulation equipment. Patent CN109852311B discloses an adhesive composition for polyolefin composite insulators, which consists of different proportions of chlorinated polypropylene, epoxy resin, 3,3'dimethyl-4,4'-diaminodicyclohexylmethane , an amino coupling agent and an organic solvent, etc., and the shear strength of the composition after bonding polyolefin sheds and epo...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C09J123/28C09J163/02
CPCC09J123/28
Inventor 全一武高云严姗芝陈强
Owner NANJING UNIV
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