Method for automatically supplementing resin for resin plug hole plate
A technology of resin plugging and resin, which is applied to printed circuits, electrical components, printed circuits, etc., can solve the problems of increased manufacturing costs, low production efficiency of manual resin filling, missing resin filling, etc., to reduce labor costs and reduce quality risks , the effect of improving production efficiency
Active Publication Date: 2021-09-10
SHENZHEN BOMIN ELECTRONICS
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Problems solved by technology
[0003] Most of the current resin plugging holes adopt the vacuum resin plugging process, but since the holes that need to be plugged with resin on each board range from 20,000 to 30,000 to as many as 100,000, individual holes will appear after plugging. Dents, bubbles, cavities, etc. need to be repaired
[0004] In the prior art, it is conventional to use manual resin replenishment to repair depressions, air bubbles, and hollow holes. However, this method is prone to leakage of resin due to manual operation, and the production efficiency of manual resin replenishment is low, which increases the manufacturing cost. cost
Method used
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Embodiment 1
[0033] An embodiment of the present invention provides a method for automatically replenishing resin in a resin plug orifice plate, comprising the following steps:
[0034] S1. Perform resin plugging on the hole plate to be plugged;
[0035] First, make a scanning plug hole file; the scanning plug hole file here is a scanning and filling TGZ compressed file, and the hole diameter on the corresponding plug hole plate is equal to the original drilling file hole diameter - hole copper thickness requirement * 2 - drilling loss + scanning compensation value ;
[0036] Then use the vacuum plugging machine to perform resin plugging on the plate to be plugged according to the scanning and filling TGZ file.
[0037] Wherein the orifice plate to be plugged in this embodiment is provided with a two-dimensional code on the edge of the plate, and the two-dimensional code contains the information of the orifice plate to be plugged, including but not limited to the number of holes, the mode...
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The invention discloses a method for automatically supplementing resin for a resin plug hole plate. The method comprises the following steps: performing resin hole plugging on a to-be-plugged hole plate, and grinding the resin; scanning the plate with the rubbed resin plug, and generating a scanning hole patching file; and carrying out automatic resin dispensing on the to-be-repaired hole in the resin plug hole plate. According to the method, the hole patching file is generated through scanning, and a dispensing machine automatically recognizes the two-dimensional code of the resin plate to be patched and performs automatic resin patching on the defective hole in the resin plug hole plate according to the hole patching file corresponding to the two-dimensional code. Compared with a conventional manual resin supplementing mode, the resin supplementing speed is increased, automatic production is achieved, and the problems of missed resin supplementing and low resin supplementing efficiency caused by manual resin supplementing are solved.
Description
technical field [0001] The invention belongs to the technical field of printed circuit board manufacturing, and in particular relates to a method for automatically replenishing resin in a resin plug hole plate. Background technique [0002] With the rapid development of electronic information technology, higher requirements are put forward for printed circuit boards. A considerable part of the through-hole plug ink originally used in the production of printed circuit boards has been replaced by resin plugging. On the one hand, The shrinkage of resin curing is much smaller than that of ink, and the possibility of voids is less, which can eliminate the problem of poor conductivity caused by residual liquid in the hole; Requirements, and the use of resin plug holes can solve the problem of holes in the plate. [0003] Most of the current resin plugging holes adopt the vacuum resin plugging process, but since the holes that need to be plugged with resin on each board range from...
Claims
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IPC IPC(8): H05K3/00
CPCH05K3/0094H05K2201/0959
Inventor 黄建国徐俊子张长明王强徐缓
Owner SHENZHEN BOMIN ELECTRONICS