Heating floor
A floor and heating chip technology, applied in the field of home building materials, can solve the problems of uneven heat, limited heating range of air conditioners, and low heat utilization rate.
Pending Publication Date: 2021-09-14
PHOTON TECH BEIJING INC
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Problems solved by technology
However, compared with floor heating, the air conditioner heats from top to bottom, which will cause uneven heat generation and cause physical discomfort to people, and the heating range of the air conditioner is limited, and the heat utilization rate is low. will make noise
At the same time, in some areas, heating elements are placed directly under the wooden floor to achieve the effect of floor heating, but simply heating the wooden floor will cause large deformation of the wooden floor and cause irreparable damage
Method used
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[0029] In the following, only some exemplary embodiments are briefly described. As those skilled in the art would realize, the described embodiments may be modified in various different ways, all without departing from the spirit or scope of the present invention. Accordingly, the drawings and descriptions are to be regarded as illustrative in nature and not restrictive.
[0030] figure 1 A schematic cross-sectional view of a heating floor according to an embodiment of the present invention is shown.
[0031] First, see figure 1 As shown, the embodiment of the present invention provides a heating floor, including a bottom layer 130 , a heating chip 120 and a surface layer 110 .
[0032] The heating chip 120 is arranged on the bottom layer 130, and the heating chip 120 includes an electrothermal conversion material and a first substrate, and the electrothermal conversion material is covered on the first substrate by vacuum coating to form a conductive layer. A substrate is ...
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Abstract
The embodiment of the invention provides a heating wood floor. The heating wood floor comprises a base material, a heating chip and a surface layer, wherein the heating chip is arranged on the base material and comprises an electro-thermal conversion material and a first substrate, the electro-thermal conversion material covers the first substrate through vacuum coating so as to form a conductive layer, and the first substrate is packaged so as to form the heating chip; the surface layer covers the heating chip; and the bottom layer and / or the surface layer comprise / comprises wood resource materials subjected to carbonization treatment. According to the heating wood floor, the heating chip is electrified to generate heat so as to achieve a heating effect, and the base material and / or the surface layer are / is carbonized, so that the deformation of the base material and / or the surface layer due to temperature rise of the heating chip is effectively reduced.
Description
technical field [0001] The invention relates to the technical field of home building materials, in particular to a heating floor. Background technique [0002] At present, winter in the south is cold and wet, and there are no effective heating measures in the south except for the use of air conditioners. Therefore, most southern regions use air conditioning for heating without underfloor heating. However, compared with floor heating, the air conditioner heats from top to bottom, which will cause uneven heat generation and cause physical discomfort to people, and the heating range of the air conditioner is limited, and the heat utilization rate is low. There will be noise. At the same time, in some areas, heating elements are directly placed under the wooden floor in order to achieve the effect of floor heating, but simply heating the wooden floor will cause large deformation of the wooden floor and cause irreparable damage. Contents of the invention [0003] An embodime...
Claims
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IPC IPC(8): E04F15/04F24D13/02B27M1/06
CPCE04F15/04F24D13/024B27M1/06
Inventor 李永武杨敏
Owner PHOTON TECH BEIJING INC