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A component lead forming device and method of using the same

A component and lead technology, applied in the field of component lead forming devices, can solve the problems that standard forming cannot meet design requirements, poor forming quality stability, affecting welding reliability, etc., and achieve high bending forming efficiency and dimensional stability. , the effect of simple structure

Active Publication Date: 2022-07-22
SHANGHAI SPACEFLIGHT ELECTRONICS & COMM EQUIP RES INST
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  • Description
  • Claims
  • Application Information

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Problems solved by technology

Although component forming equipment on the market is relatively common, most of them are aimed at standard forming. In some cases, standard forming cannot meet the design requirements of other forming parameters. If manual forming is used, not only the operation efficiency is low, but also the quality stability of forming is poor. , and if the clamping is improper, it is easy to generate internal stress at the root of the pin, which will affect the reliability of subsequent soldering and even damage components

Method used

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  • A component lead forming device and method of using the same
  • A component lead forming device and method of using the same
  • A component lead forming device and method of using the same

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Embodiment Construction

[0041] The following will combine Figure 1 to Figure 10 A component lead forming device provided by the present invention is described in detail. This embodiment is implemented on the premise of the technical solution of the present invention, and a detailed implementation manner and a specific operation process are given, but the protection of the present invention is given. The scope is not limited to the following embodiments, and those skilled in the art can make modifications and improvements within the scope of not changing the spirit and content of the present invention.

[0042] Please refer to Figure 1 to Figure 10 , a component lead forming device, the component 5 includes a component body 51 and a lead 52; the forming device includes:

[0043]The body clamping module 1 includes a lower pressing plate 11 and an adjusting plate 13, the adjusting plate 13 is movably arranged on the upper end surface of the lower pressing plate 11, and the adjusting plate 13 can move...

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Abstract

The invention relates to a component lead forming device and a method for using the same, wherein the forming device includes a body clamping module, a pin clamping module, a fixing adjustment module and a forming module. The first clamping plate and the second clamping plate of the body clamping module are clamped, and the pins on both sides of the component body are placed on the first clamping plate and the second clamping plate respectively; the pins on one side of the component are pressed by the pin clamping module. The clamping plate is pressed against the second clamping plate; the fixing adjustment module is used to fix the position of the components after the clamping is completed, so as to prevent the root of the pin from being stressed during forming due to insufficient clamping; the forming module is used to adjust the element according to the forming parameters. The device leads are bent and formed. The technology of the invention adopts an adjustable structure to satisfy the body clamping of various specifications of components and the clamping and forming operations of the pins, and has the advantages of low cost, simple operation and high degree of generalization.

Description

technical field [0001] The invention relates to the technical field of electronic product processing, in particular to a component lead forming device and a method for using the same. Background technique [0002] With the continuous increase in the type and quantity of electronic products, the use of various electronic components also increases. Since most of the component pins are in a straight state initially, they need to be pin-shaped when in use to meet the needs of insertion or placement. Although the component forming equipment on the market is relatively common, most of them are aimed at standard forming. In some cases, standard forming cannot meet the design requirements of other forming parameters. If manual forming is used, not only the operation efficiency is low, but also the quality stability of forming is poor. , and if the clamping is improper, it is easy to generate internal stress at the root of the pin, which affects the reliability of subsequent welding...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B21F1/00
CPCB21F1/006
Inventor 汤小双胡佳张海峰戴琳姚冬妮向克勤
Owner SHANGHAI SPACEFLIGHT ELECTRONICS & COMM EQUIP RES INST
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