Furnace passing carrier

A carrier and furnace technology, applied in the manufacturing of electrical components, circuits, semiconductor/solid-state devices, etc., can solve the problems of no mounting and high defective rate of chip products, to ensure yield, improve processing efficiency, and prevent edge picking. Effect

Active Publication Date: 2021-09-17
SPREADTRUM COMM (SHANGHAI) CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

After the chip is modularized, its peripheral circuits are all important devices and are not equipped with specific application devices in various industries. Therefore, a secondary furnace is required to expand the function when mounting the chip. Then the shielding frame (cover) will follow the surface mount technology ( Surface mounting technology (SMT) furnace temperature and the surface tension of the solder paste warp, resulting in a high overall defect rate of chip products

Method used

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  • Furnace passing carrier
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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0049] Aiming at the problems existing in the prior art, Embodiment 1 of the present invention provides a furnace carrier, such as Figure 1 to Figure 3 As shown, it includes: a fixture plate 1, a carrier plate 2 and a plurality of elastic telescopic components 3, and a fixing component 4 is provided on the fixture plate 1 and the carrier plate 2, and the fixing component 4 is used to connect and fix the fixture plate 1 and the carrier plate 2. A plurality of elastic telescopic components 3 are arranged at a plurality of first hollow areas 101 of the fixture board 1, and the carrier board 2 is provided with a plurality of placement slots 201 for accommodating circuit boards with shielding covers, and each elastically telescopic The assembly 3 is arranged corresponding to each placement groove 201, and each placement groove 201 is arranged corresponding to each hollowed-out area.

[0050]Specifically, most of the existing circuit boards with shielding frames are rectangular or ...

Embodiment 2

[0069] Embodiment 2 is an alternative solution based on Embodiment 1, the difference is that, as Figure 7 As shown, the fixing assembly 4 includes: a bolt 402 and a threaded hole, the fixture plate 1 is provided with a through hole, the threaded hole corresponds to the through hole and is arranged on the carrier plate 2, and the bolt 402 is arranged in cooperation with the threaded hole.

[0070] Specifically, in this embodiment, the fixture plate 1 is provided with two through holes, and the centers of the two through holes are arranged symmetrically, and the carrier plate 2 is provided with two threaded holes corresponding to the two through holes. When in use, after docking the fixture plate 1 and the carrier plate 2, screw the bolt 402 into the threaded hole through the through hole.

[0071] In addition, the bolt 402 can be set on the fixture plate 1 in a built-in rotatable manner, which saves the process of picking and placing the bolt 402 during disassembly, and simpli...

Embodiment 3

[0073] Embodiment 3 is an improved solution based on Embodiment 1, and its improvements are as follows: Figure 8 As shown, a linkage rod 6 is provided between the second elastic expansion device and the plurality of first elastic expansion devices 301 .

[0074] Specifically, in this embodiment, the linkage rod 6 is arranged on the moving rod 303 of the first elastic expansion device 301 and the second elastic expansion device 302, and the bottom surface of the linkage rod 6 is flush with the bottom surface of the movement rod 303. In this way, the linkage between the first elastic expansion device 301 and the second elastic expansion device 302 can be realized, and the active area of ​​the elastic expansion assembly 3 can be increased.

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Abstract

The invention provides a furnace passing carrier which comprises a clamp plate, a carrier plate and a plurality of elastic telescopic assemblies, wherein fixing assemblies are arranged on the clamp plate and the carrier plate, the fixing assemblies are used for connecting and fixing the clamp plate and the carrier plate, and the elastic telescopic assemblies are arranged at a plurality of first hollowed-out areas of the clamp plate. The carrier plate is provided with a plurality of placing grooves used for containing circuit boards with shielding covers, the elastic telescopic assemblies are arranged corresponding to the placing grooves, and the placing grooves are arranged corresponding to the hollow areas. The furnace passing carrier is used for improving the warping problem of a modular product with a shielding cover in the secondary furnace passing process.

Description

technical field [0001] The invention relates to the field of integrated circuit processing, in particular to a furnace carrier. Background technique [0002] At present, chips have been widely used in various industries, and modular products have gradually become an important choice for integrated products. After the chip is modularized, its peripheral circuits are all important devices and are not equipped with specific application devices in various industries. Therefore, a secondary furnace is required to expand the function when mounting the chip. Then the shielding frame (cover) will follow the surface mount technology ( Surface mounting technology (SMT) furnace temperature and the surface tension of the solder paste warp, which in turn causes the overall defect rate of chip products to be high. Contents of the invention [0003] The purpose of the present invention is to provide a furnace passing carrier, which is used to improve the warping problem of the modular p...

Claims

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Application Information

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IPC IPC(8): H01L21/673
CPCH01L21/67333
Inventor张杰朱海峰张坚强刘连张大伟万杰夏请胡廷前
OwnerSPREADTRUM COMM (SHANGHAI) CO LTD