Ceramic part cleaning method
A technology after cleaning of ceramic parts, applied in cleaning methods and utensils, cleaning methods using liquids, chemical instruments and methods, etc., can solve problems such as exceeding the standard, achieve the effect of solving the quantity exceeding the standard and improving the chip yield rate
Pending Publication Date: 2021-09-21
BEIJING NAURA MICROELECTRONICS EQUIP CO LTD
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Problems solved by technology
[0005] The present invention aims to solve at least one of the technical problems in the prior art, and proposes a cleaning method for ceramic parts, which can effectively remove impurities attached due to electrostatic effects or tiny particles in microcracks, thereby solving the problem of ceramic particles The problem of excessive quantity can improve the yield rate of chips
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[0034] In order to enable those skilled in the art to better understand the technical solutions of the present invention, the method for cleaning ceramic parts provided by the embodiments of the present invention will be described in detail below in conjunction with the accompanying drawings.
[0035] The flow process of the cleaning method of the ceramic parts in the prior art is: firstly, the ceramic parts are soaked in an alkaline degreasing agent for 30min-60min, and then the ceramic parts are put into deionized water for rinsing (using pressurized deionized water to spray the surface of the ceramic parts) everywhere); after that, immerse the ceramic parts in the acid solution for 30s-60s, then take the ceramic parts out of the solution, and immerse them in deionized water again for the above rinsing, and then immerse them in deionized water with a resistivity ≥ 4MΩ·cm and room temperature Perform ultrasonic cleaning in water for 1min-5min, then immerse the ceramic parts in...
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Abstract
The embodiment of the invention provides a ceramic part cleaning method. The method comprises the following steps that a first cleaning process is conducted, specifically, ultrasonic cleaning is conducted on a ceramic part by adopting an organic solvent with conductivity; a second cleaning process is conducted, specifically, the ceramic part cleaned in the first cleaning process is subjected to ultrasonic cleaning so as to remove residual organic solvents and particles on the ceramic part; and a third cleaning process is conducted, the cleaned ceramic part is purged, and the ceramic part is baked after purging. According to the ceramic part cleaning method, impurities attached due to the electrostatic effect or tiny particles in microcracks can be effectively removed, so that the problem that the number of ceramic particles exceeds the standard can be solved, and the chip yield is improved.
Description
technical field [0001] The invention relates to the field of semiconductor manufacturing, in particular to a cleaning method for ceramic parts. Background technique [0002] Alumina ceramics are a kind of aluminum oxide (Al 2 o 3 , AlN) as the main body of the ceramic material, is the most stable substance in oxides, has the advantages of high temperature resistance, corrosion resistance, wear resistance, high mechanical strength, high hardness, high electrical insulation and low dielectric loss, which makes Alumina ceramic materials are increasingly used in semiconductor devices. However, during the molding process of granulation, sintering and machining, etc., this material will inevitably adhere to impurities such as dust on the surface due to electrostatic effects, and it is easy to produce some powdery particles in the microcracks on the surface of ceramic parts. Once these impurities and small particles fall on the wafer during the semiconductor manufacturing proces...
Claims
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IPC IPC(8): B08B3/08B08B3/12B08B3/02B08B13/00F26B7/00
CPCB08B3/08B08B3/12B08B3/02B08B13/00F26B7/00
Inventor 闫昊王宏伟符雅丽郑友山
Owner BEIJING NAURA MICROELECTRONICS EQUIP CO LTD