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Circuit board flattening device

A circuit board and platen technology, applied in printed circuits, printed circuit manufacturing, electrical components, etc., can solve the problems of low flattening efficiency, inability to adjust, and narrow applicability, so as to reduce potential safety hazards, improve flattening efficiency, and improve The effect of suitability

Pending Publication Date: 2021-09-21
聂三磊
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] At present, this flattening method needs to move back and forth, and the flattening efficiency is low. At the same time, it cannot be adjusted, and it cannot adapt to the flattening of circuit boards with different thicknesses. narrower

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0037] see figure 1 , the present invention provides a technical solution: a circuit board flattening device, including a flattening assembly 100 , an adjusting assembly 200 and a feeding assembly 300 .

[0038] Among them, the flattening assembly 100 plays the role of flattening the circuit board, the adjustment assembly 200 plays the role of adjusting according to the thickness of the circuit board, and the feeding assembly 300 plays the role of loading and unloading the circuit board.

[0039] see figure 1 , figure 2 and Figure 4 The flattening assembly 100 includes a fixed frame 110, a first telescopic member 120, a pressing plate 130, and a support platform 140. There are two first telescopic members 120, and the two first telescopic members 120 are fixedly installed on the fixed frame 110. It should be noted that Yes, the first telescopic member 120 can be a hydraulic cylinder, the first telescopic member 120 is fixed by bolts, and the pressure plate 130 is fixedly ...

Embodiment 2

[0043] see figure 1 , the present invention provides a technical solution: a circuit board flattening device, including a flattening assembly 100 , an adjusting assembly 200 and a feeding assembly 300 .

[0044] Among them, the flattening assembly 100 plays the role of flattening the circuit board, the adjustment assembly 200 plays the role of adjusting according to the thickness of the circuit board, and the feeding assembly 300 plays the role of loading and unloading the circuit board.

[0045] see figure 1 , figure 2 and Figure 4 The flattening assembly 100 includes a fixed frame 110, a first telescopic member 120, a pressing plate 130, and a support platform 140. There are two first telescopic members 120, and the two first telescopic members 120 are fixedly installed on the fixed frame 110. It should be noted that Yes, the first telescopic member 120 can be a hydraulic cylinder, the first telescopic member 120 is fixed by bolts, and the pressure plate 130 is fixedly ...

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Abstract

The invention provides a circuit board flattening device, and belongs to the technical field of circuit board processing equipment. The circuit board flattening device comprises a flattening assembly, an adjusting assembly and a feeding assembly. The flattening assembly comprises a fixing frame, a first telescopic piece, a pressing plate and a supporting platform. Through the arrangement of the first telescopic piece, the pressing plate and the supporting platform, the first telescopic piece pushes the pressing plate to move downwards, a circuit board on the supporting platform can be flattened, reciprocating motion is not needed, the flattening efficiency is improved, through the arrangement of a threaded rod and a positioning rod, the extending height of the positioning rod can be adjusted according to the thickness of the circuit board, the falling height of the pressing plate can be limited, the circuit board can be protected against damage caused by too large pressure, through the arrangement of a second telescopic piece, a tray and a driving piece, the circuit board can be placed on the tray, conveyed into the equipment through the driving piece and taken out after being flattened, potential safety hazards are reduced, and through the arrangement, the applicability of the equipment is improved.

Description

technical field [0001] The invention relates to the technical field of circuit board processing equipment, in particular to a circuit board flattening device. Background technique [0002] In order to improve the service life of the circuit board, most companies usually plate a thin layer of gold plating on the surface of the circuit board, and the circuit board needs to be leveled before the gold plating process, so that the ions in the electroplating solution can efficiently adhere to it. On the surface of the circuit board, the common method of flattening the circuit board is to use the method of pressing rollers to flatten. The pressure roller moves back and forth on the circuit board that needs to be flattened, which is a method to achieve flattening. [0003] At present, this flattening method needs to move back and forth, and the flattening efficiency is low. At the same time, it cannot be adjusted, and it cannot adapt to the flattening of circuit boards with differe...

Claims

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Application Information

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IPC IPC(8): B29C53/18B29C53/80H05K3/00
CPCB29C53/18B29C53/80H05K3/00
Inventor 聂三磊
Owner 聂三磊
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