Silicon carbide ceramic slurry with high photosensitive activity and preparation method thereof
A technology of silicon carbide ceramics and silicon carbide powder, applied in the field of 3D printing materials, can solve the problems of poor surface quality, difficult carbon-silicon ratio, hardness, high-temperature mechanical strength and low corrosion resistance, and achieve the effect of avoiding silicon residues
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[0041] The present invention also provides a method for preparing a silicon carbide ceramic slurry with high photosensitive activity, which comprises the following steps:
[0042] STEP101: Weigh the silicon carbide powder, boron carbide powder, acrylic acid oligomer, reactive diluent, photoinitiator, co-initiator, and auxiliary agent respectively by weight percentage, wherein the weight percentage of the silicon carbide powder The percentage by weight of the boron carbide powder is 2% to 2.2%, the percentage by weight of the reactive diluent is 16.8% to 24.9%, and the percentage by weight of the photoinitiator is 1.29% to 1.71%, the weight percentage of the co-initiator is 0.21%~0.29%, the weight percentage of the auxiliary agent is 2%~2.2%;
[0043] STEP102: Disperse and mix the acrylic acid oligomer, the reactive diluent, the photoinitiator, the co-initiator, and the auxiliary agent at a speed of 1000-1500r / min under yellow light to obtain an organic carrier;
[0044] STEP...
Embodiment 1
[0049] The high-photosensitivity silicon carbide slurry in Example 1 of the present invention includes the following components in terms of weight percent: α-type silicon carbide powder with a purity of 99.5%: 68.47%; boron carbide powder with a purity of 95%: 2.04%; Phenol A type epoxy acrylate: 5.11%; Trimethylolpropane triacrylate: 15.33%; 3,3'-(oxybismethylene)bis(3-ethyl)oxetane: 5.11 %; 2-Dimethylamino-2-(4-methyl)benzyl-1-[4-(4-morpholinyl)phenyl]-1-butanone: 0.77%; 2-isopropylthia Anthrone: 0.26%; N, N-dibenzyl ethyl formate: 0.26%; 4,4'-diacetamidodiphenyliodonium hexafluorophosphate: 0.51%; Dispersant: 2%, and disinfectant Foaming agent; 0.15%.
[0050] The high photosensitivity silicon carbide slurry prepared above has a viscosity of 6490 mPa·s. Cured by a DLP 3D printer with a light source wavelength of 385nm. When the exposure power is 200mW / cm 2 , Continuous exposure for 30s can obtain a cured thickness of 30um, and the hardness of the film layer is relativel...
Embodiment 2
[0052] The high-photosensitivity silicon carbide slurry of Example 2 of the present invention includes the following components in terms of weight percent: α-type silicon carbide powder with a purity of 99.3%: 68.47%; boron carbide powder with a purity of 92%: 2.04%; Phenol A type epoxy acrylate: 2.55%; dipentaerythritol hexaacrylate: 17.88%; 3-ethyl-3-hydroxymethyl oxetane: 5.11%; 2-dimethylamino-2-benzyl- 1-(4-piperidylphenyl)-1-butanone: 0.77%; 2-isopropylthioxanthone: 0.26%; N,N-dimethylbenzoic acid-2-ethylhexyl ester: 0.26 %; p-benzoyl diphenyl iodonium hexafluorophosphate: 0.51%; dispersant: 2%, and defoamer; 0.15%.
[0053] The high photosensitivity silicon carbide slurry prepared from the above materials has a viscosity of 5540mPa·s. Cured by a DLP 3D printer with a light source wavelength of 385nm. When the exposure power is 250mW / cm 2 , Continuous exposure for 20s can obtain a cured thickness of 42um, and the hardness of the film layer is relatively high.
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