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Thermal shock resistant conductor paste for thick film circuit

A conductor paste, thick film circuit technology, applied to conductive materials dispersed in non-conductive inorganic materials, etc., can solve the problems of adhesion failure of thick film circuit products, limit the application range of conductor paste, etc., and achieve excellent adhesion , The effect of improved thermal shock resistance and rapid changes in ambient temperature

Active Publication Date: 2021-09-28
西安宏星电子浆料科技股份有限公司
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  • Summary
  • Abstract
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  • Claims
  • Application Information

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Problems solved by technology

However, for aviation, aerospace and other fields that have high reliability and extreme environmental requirements for thick-film circuits, due to repeated and rapid changes in ambient temperature, a large number of thick-film circuit products fail to adhere, which greatly limits the application range of conductor paste.

Method used

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  • Thermal shock resistant conductor paste for thick film circuit
  • Thermal shock resistant conductor paste for thick film circuit
  • Thermal shock resistant conductor paste for thick film circuit

Examples

Experimental program
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Effect test

Embodiment

[0016] Preparation of spodumene-modified glass powder: According to the weight percentages of various oxides and spodumene listed in Table 1, after mixing the various substances evenly, the resulting mixture was smelted in a melting furnace at 1250 ° C for 1 hour to obtain a uniform For the clarified molten glass, quench the molten glass with water to obtain glass, break the glass into glass slag, and grind the glass slag with a ball mill to a particle size of 0.8-1.2 μm to obtain spodumene modified glass powder.

[0017] Table 1 Spodumene modified glass powder formula

[0018]

[0019] Preparation of heat-treated aluminum-magnesium hydrotalcite powder: According to the process parameters listed in Table 2, aluminum-magnesium hydrotalcite powder with different particle size ranges was roasted at different temperatures in a muffle furnace for different times to obtain heat-treated aluminum-magnesium hydrotalcite powder.

[0020] Table 2 Process parameters for the preparation...

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Abstract

The invention discloses a thermal shock resistant conductor paste for a thick film circuit, which is a paste paste with certain fluidity prepared by mixing noble metal powder, a thermal shock resistant modified material, an inorganic oxide and an organic carrier. The thermal shock resistant modified material is composed of heat-treated aluminum-magnesium hydrotalcite powder and spodumene modified glass powder, the heat-treated aluminum-magnesium hydrotalcite powder is obtained by roasting aluminum-magnesium hydrotalcite powder with the particle size of 0.5-0.8 [mu]m at 500 + / -10 DEG C for 60 + / -5 min, and the spodumene modified glass powder is obtained by introducing spodumene into a glass formula. By adding the heat-treated aluminum magnesium hydrotalcite powder and spodumene modified glass powder into the conductor paste, the reliability of the conductor paste after thermal shock after welding is improved, the use requirement of the conductor paste in a high-reliability thick-film circuit is ensured, and the thick-film circuit product can be applied to harsh environments such as aviation and spaceflight, and the application range of the thick-film circuit product is widened; and the field of high reliability requirements on circuit products due to fast and large change of environment temperature is also provided.

Description

technical field [0001] The invention belongs to the technical field of conductor paste for thick film circuits, in particular to a conductor paste for thick film circuits with thermal shock resistance. Background technique [0002] Electronic paste is the basic material for the manufacture of thick film components. It is a paste made of solid powder and organic solvents mixed uniformly by three-roll rolling. It is widely used in thick film products in the modern microelectronics industry. In the thick film circuit products of the modern microelectronics industry, people have higher and higher requirements for electronic components. Thick film circuit products are widely used, especially in fields with severe environmental requirements such as aviation and aerospace. made a request. This also correspondingly puts forward requirements on the thermal shock resistance of the conductive paste, and it is imperative to carry out research on new conductive pastes. [0003] General...

Claims

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Application Information

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IPC IPC(8): H01B1/16H01B1/22C03C12/00
CPCH01B1/16H01B1/22C03C12/00
Inventor 鹿宁赵科良殷美孙社稷党丽萍赵敏何依青刘琪瑾
Owner 西安宏星电子浆料科技股份有限公司
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